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FQP46N15

Onsemi

FQP46N15 by Onsemi

FQP46N15 by Onsemi is a Power FET with N-CHANNEL polarity, 150V DS breakdown voltage, and 0.042 ohm max on-resistance. Ideal for switching applications, it has a max drain current of 45.6A, 182.4A pulsed drain current, and 210W power dissipation rating.

Median Price

$1.642

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1 parts In-Stock

1+ parts

$2.034

100+ parts

$1.738

1k+ parts

$1.222

10k+ parts

$1.102

1

$2.034

$1.738

$1.222

$1.102

DigiKey

USA . 40,910 parts In-Stock

1+ parts

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$0.670

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40,910

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$0.670

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Flip Electronics (Authorized)

USA . 1,860 parts In-Stock

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1,860

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Rochester

USA . 130 parts In-Stock

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$1.250

1k+ parts

$1.040

10k+ parts

$0.925

130

-

$1.250

$1.040

$0.925

RS (Exports)

UK . 25 parts In-Stock

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$2.105

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25

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$2.105

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Distributors (In-Stock)

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Digiode

USA . 1,669 parts In-Stock

1+ parts

$0.978

100+ parts

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1,669

$0.978

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Nova Conductors

Japan . 50 parts In-Stock

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$1.260

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$1.260

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Flip Electronics

USA . 40,910 parts In-Stock

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40,910

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Chip Stock

USA . 3,500 parts In-Stock

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Odi Ramu Company

Canada . 1,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 550 parts In-Stock

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Vyrian

USA . 248 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 86 parts In-Stock

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Holdelec - ElecDif-Pro

France . 86 parts In-Stock

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Semtec, LLC

USA . 10 parts In-Stock

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10

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Prism Electronics

USA . 9 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 95 parts In-Stock

1+ parts

$0.880

100+ parts

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95

$0.880

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Aztec Data Supply Inc.

USA . 546 parts In-Stock

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$0.926

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546

$0.926

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Corphita

USA . 2,266 parts In-Stock

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$0.927

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2,266

$0.927

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Corohmni

South Africa . 188 parts In-Stock

1+ parts

$1.030

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188

$1.030

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Component Stockers USA

USA . 324 parts In-Stock

1+ parts

$1.040

100+ parts

$0.980

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324

$1.040

$0.980

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Continental Prestige Electronics

USA . 5,869 parts In-Stock

1+ parts

$1.260

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$1.235

5,869

$1.260

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$1.235

Argo Parts USA

USA . 2,086 parts In-Stock

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$1.260

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2,086

$1.260

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Netroflash

USA . 500 parts In-Stock

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$1.260

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$1.235

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$1.260

$1.235

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RC Electronics

USA . 47,405 parts In-Stock

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$1.400

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$1.280

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$1.240

47,405

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$1.400

$1.280

$1.240

Perfect Parts

USA . 35,728 parts In-Stock

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Lixinc

USA . 17,877 parts In-Stock

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Infinite Electronics LLP (Excess)

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Supply Digital

USA . 2,297 parts In-Stock

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SupplyDigital Components

Austria . 1,981 parts In-Stock

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Assy Fe

Spain . 1,003 parts In-Stock

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Kepictronics

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 542 parts In-Stock

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Kulean Microsystems

USA . 513 parts In-Stock

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TANS Electronics

Latvia . 268 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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100

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Problanco Electronics

Mexico . 90 parts In-Stock

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ChipstoGo Electronic ltd

UK . 50 parts In-Stock

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50

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Overview

Unlock the power of innovation with the FQP46N15 from Onsemi. This high-quality Power FET offers unrivaled performance and reliability, making it the perfect choice for a wide range of switching applications. With a built-in diode and a maximum power dissipation of 210W, this N-CHANNEL transistor provides exceptional value and efficiency. Trust in Onsemi's expertise and experience to deliver cutting-edge technology that exceeds expectations. Elevate your projects with the FQP46N15 and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and faster switching speeds, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from voltage spikes.

Transistor Application: SWITCHING

Designed for switching applications, offering fast turn-on and turn-off times for efficient performance.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this FET can handle high voltage applications without breakdown.

Package Shape: RECTANGULAR

Rectangular shape facilitates easy mounting and placement on circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections for reliable performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off and require a positive voltage to turn on, offering precise control.

Maximum Pulsed Drain Current (IDM): 182.4 A

High pulsed drain current capability allows the FET to handle temporary overloads without damage.

Avalanche Energy Rating (EAS): 650 mJ

The high avalanche energy rating ensures protection against voltage spikes and transient events.

Maximum Drain Current (Abs) (ID): 45.6 A

With a high maximum drain current rating, this FET can handle high current loads without overheating.

No. of Terminals: 3

Three terminals for easy connection and integration into circuits.

Maximum Power Dissipation (Abs): 210 W

High power dissipation capability allows the FET to handle significant power levels without damage.

Package Style (Meter): FLANGE MOUNT

Flange mount package style provides secure mounting and heat dissipation for better performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low gate capacitance for faster switching speeds.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this FET can operate reliably in harsh environments.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, low leakage, and better thermal stability for reliable operation.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for secure connections.

Maximum Drain-Source On Resistance: 0.042 ohm

Low drain-source on resistance minimizes power losses and improves efficiency in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and prevents incorrect connections.

Technical Specifications

Power Field Effect Transistors (FET) FQP46N15 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

45.6 A

Maximum Drain Current (ID):

45.6 A

Maximum Drain-Source On Resistance:

.042 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

182.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQP46N15 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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