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FQD9N25TM-F085

Onsemi

FQD9N25TM-F085 by Onsemi

FQD9N25TM-F085 by Onsemi is a N-CHANNEL Power FET with 250V DS Breakdown Voltage, 29.6A IDM, and 165mJ EAS. Ideal for SWITCHING applications, it features SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating in ENHANCEMENT MODE, it has a max power dissipation of 55W at 150 °C max temp.

Median Price

$0.440

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 126,300 parts In-Stock

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Flip Electronics (Authorized)

USA . 126,300 parts In-Stock

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Vyrian

USA . 1,211 parts In-Stock

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$1.440

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Flip Electronics

USA . 126,300 parts In-Stock

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DigiKey Marketplace

USA . 126,300 parts In-Stock

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Digiode

USA . 2,714 parts In-Stock

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Greenchips

USA . 2,500 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 2,500 parts In-Stock

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Corohmni

South Africa . 330 parts In-Stock

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$1.440

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Microchip USA

USA . 492 parts In-Stock

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$3.354

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Component Stockers USA

USA . 323 parts In-Stock

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$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,693 parts In-Stock

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Kulean Microsystems

USA . 6,593 parts In-Stock

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Perfect Parts

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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TANS Electronics

Latvia . 2,938 parts In-Stock

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Corphita

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SupplyDigital Components

Austria . 1,666 parts In-Stock

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 618 parts In-Stock

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Problanco Electronics

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Native Components

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Supply Digital

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Overview

Unleash the power of innovation with the FQD9N25TM-F085 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for various switching applications. This N-CHANNEL transistor offers unmatched performance and reliability, with a built-in diode for added convenience. With a high DS Breakdown Voltage of 250V and a maximum Drain Current of 7.4A, this transistor is designed to handle even the most demanding tasks. Trust Onsemi to provide cutting-edge technology that will elevate your projects to new heights. Experience the difference with the FQD9N25TM-F085 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and protection for the internal components of the Power FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher mobility and better performance compared to P-channel FETs, making this product a good choice for high efficiency applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this Power FET ensures fast response times and efficient power management.

Maximum Power Dissipation (Abs): 55 W

With a high power dissipation rating, this Power FET can handle heavy loads and operate reliably in demanding conditions.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows this Power FET to function effectively in a wide range of environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) FQD9N25TM-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

165 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

7.4 A

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.42 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

29.6 A

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

160 ns

Maximum Turn On Time (ton):

255 ns

Trade Compliance

FQD9N25TM-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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