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FQD9N25TM-F080

Onsemi

FQD9N25TM-F080 by Onsemi

FQD9N25TM-F080 by Onsemi is a N-CHANNEL Power FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 29.6A, EAS of 165mJ, and 0.42 ohm Drain-Source Resistance. The transistor operates in ENHANCEMENT MODE and has a max power dissipation of 55W at 150°C.

Median Price

$0.617

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 600 parts In-Stock

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$0.617

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600

$0.617

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Chip Stock

USA . 80,000 parts In-Stock

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80,000

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Digiode

USA . 1,279 parts In-Stock

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1,279

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Vyrian

USA . 203 parts In-Stock

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203

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Distributors (Availability)

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Corohmni

South Africa . 359 parts In-Stock

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$0.605

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359

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Continental Prestige Electronics

USA . 3,341 parts In-Stock

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$0.617

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$0.605

3,341

$0.617

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$0.605

Argo Parts USA

USA . 2,510 parts In-Stock

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$0.617

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$0.598

2,510

$0.617

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$0.598

Aztec Data Supply Inc.

USA . 4,401 parts In-Stock

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$1.929

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4,401

$1.929

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Semicontronic

India . 281 parts In-Stock

1+ parts

$7.050

100+ parts

$6.874

1k+ parts

$6.838

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281

$7.050

$6.874

$6.838

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AZTECH Wire

Italy . 544 parts In-Stock

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$18.854

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544

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Ampacity Inc.

Singapore . 2,341 parts In-Stock

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$31.050

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Problanco Electronics

Mexico . 7,250 parts In-Stock

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TANS Electronics

Latvia . 4,913 parts In-Stock

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Authorized Procurement Solutions

USA . 4,500 parts In-Stock

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SupplyDigital Components

Austria . 1,345 parts In-Stock

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Netroflash

USA . 1,050 parts In-Stock

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$0.605

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$0.586

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$0.574

1,050

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$0.586

$0.574

Supply Digital

USA . 953 parts In-Stock

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953

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Corphita

USA . 920 parts In-Stock

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920

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Kulean Microsystems

USA . 491 parts In-Stock

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491

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UHIMA Technologies

Türkiye . 446 parts In-Stock

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446

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Overview

Discover the power of innovation with the FQD9N25TM-F080 by Onsemi, a cutting-edge Power Field Effect Transistor designed for efficient switching applications. Crafted with precision and expertise by Onsemi, this N-CHANNEL transistor boasts a single configuration with a built-in diode, ensuring seamless performance. With a maximum power dissipation of 55W and a minimum DS breakdown voltage of 250V, this transistor offers unparalleled reliability and durability. Ideal for a wide range of applications, from industrial to automotive, this transistor is the ultimate solution for your power management needs. Trust Onsemi for top-quality products that deliver exceptional value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is resistant to external damage while also being easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs generally have lower RDS(on) values and faster switching speeds compared to P-Channel FETs, making them ideal for high-performance applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient and reliable performance when turning on or off a circuit.

Minimum DS Breakdown Voltage: 250 V

High breakdown voltage allows for the FET to operate in high voltage applications without risk of failure.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices, providing better control over the circuit and reducing power consumption when not in use.

Maximum Power Dissipation (Abs): 55 W

High power dissipation rating allows the FET to handle higher current loads efficiently without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range ensures the FET can function reliably in various environmental conditions.

Maximum Drain-Source On Resistance: 0.42 ohm

Low on-resistance helps in reducing power loss and improving efficiency in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) FQD9N25TM-F080 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

165 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

7.4 A

Maximum Drain Current (ID):

7.4 A

Maximum Drain-Source On Resistance:

.42 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

29.6 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD9N25TM-F080 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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