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FQA9P25

Onsemi

FQA9P25 by Onsemi

The Onsemi FQA9P25 is a P-CHANNEL Power FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring 42A IDM and 0.62 ohm RDS(on), it operates in ENHANCEMENT MODE at up to 150°C. The PLASTIC/EPOXY package with BUILT-IN DIODE makes it suitable for high-power RECTANGULAR FLANGE MOUNT designs.

Median Price

$2.930

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 8,247 parts In-Stock

1+ parts

$2.930

100+ parts

$1.990

1k+ parts

$1.750

10k+ parts

$1.730

8,247

$2.930

$1.990

$1.750

$1.730

DigiKey

USA . 478 parts In-Stock

1+ parts

$4.030

100+ parts

$2.217

1k+ parts

$1.817

10k+ parts

-

478

$4.030

$2.217

$1.817

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Flip Electronics (Authorized)

USA . 3,000 parts In-Stock

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3,000

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RS (Exports)

UK . 45 parts In-Stock

1+ parts

-

100+ parts

$2.269

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45

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$2.269

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,051 parts In-Stock

1+ parts

$1.000

100+ parts

-

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3,051

$1.000

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Digiode

USA . 876 parts In-Stock

1+ parts

$2.784

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876

$2.784

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Forefront Electronics and Design

USA . 5 parts In-Stock

1+ parts

$22.050

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5

$22.050

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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LIBRA Elektronik GmbH

Germany . 655 parts In-Stock

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655

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Distributors (Availability)

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Corohmni

South Africa . 393 parts In-Stock

1+ parts

$2.269

100+ parts

-

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393

$2.269

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Corphita

USA . 1,434 parts In-Stock

1+ parts

$2.637

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1,434

$2.637

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Northwest PG Solutions

USA . 1,520 parts In-Stock

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$3.122

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1,520

$3.122

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Microchip USA

USA . 367 parts In-Stock

1+ parts

$18.850

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367

$18.850

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SupplyDigital Components

Austria . 6,896 parts In-Stock

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6,896

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Kulean Microsystems

USA . 6,414 parts In-Stock

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6,414

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TANS Electronics

Latvia . 5,909 parts In-Stock

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Problanco Electronics

Mexico . 5,652 parts In-Stock

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Perfect Parts

USA . 1,394 parts In-Stock

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1,394

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Native Components

USA . 677 parts In-Stock

1+ parts

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$2.753

10k+ parts

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677

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$2.753

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UHIMA Technologies

Türkiye . 220 parts In-Stock

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220

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Supply Digital

USA . 204 parts In-Stock

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204

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Overview

Enhance your power applications with the FQA9P25 by Onsemi, a high-quality Power Field Effect Transistor that delivers reliable performance and efficiency. With its P-Channel configuration and built-in diode, this transistor is perfect for switching operations. Experience the benefits of its 250V minimum DS breakdown voltage and 42A maximum pulsed drain current, providing enhanced power handling capabilities. Trust Onsemi's expertise in semiconductor technology to bring you a product that offers value, durability, and superior functionality for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy package body material provides good insulation and thermal properties, enhancing the reliability of the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low on-resistance and high current-carrying capability, making them suitable for high efficiency applications.

Minimum DS Breakdown Voltage: 250 V

With a minimum breakdown voltage of 250V, this FET can handle higher voltages, making it suitable for applications where high voltage is a concern.

Avalanche Energy Rating (EAS): 650 mJ

The high avalanche energy rating of 650 mJ ensures that the FET can withstand transient voltage spikes, improving the ruggedness of the product.

Maximum Power Dissipation (Abs): 150 W

With a maximum power dissipation of 150W, this FET can handle high power applications without overheating, ensuring reliable performance.

Maximum Drain-Source On Resistance: 0.62 ohm

The low drain-source on resistance of 0.62 ohm results in minimal power loss and efficient operation of the FET.

Technical Specifications

Power Field Effect Transistors (FET) FQA9P25 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

650 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

10.5 A

Maximum Drain Current (ID):

10.5 A

Maximum Drain-Source On Resistance:

.62 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

42 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA9P25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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