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FQA90N15-F109

Onsemi

FQA90N15-F109 by Onsemi

FQA90N15-F109 by Onsemi is a N-CHANNEL Power FET with 150V DS Breakdown Voltage, 90A Drain Current, and 0.018 ohm RDS(ON). Ideal for SWITCHING applications, it has a max power dissipation of 375W and operates in ENHANCEMENT MODE. Suitable for high-power systems requiring efficient switching capabilities.

Median Price

$3.240

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,130 parts In-Stock

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$3.010

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$3.010

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Flip Electronics (Authorized)

USA . 2,130 parts In-Stock

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2,130

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Rochester

USA . 1,032 parts In-Stock

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$3.240

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$2.900

10k+ parts

$2.730

1,032

-

$3.240

$2.900

$2.730

Verical

USA . 597 parts In-Stock

1+ parts

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$4.050

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$3.625

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$3.413

597

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$4.050

$3.625

$3.413

Distributors (In-Stock)

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Vyrian

USA . 1,969 parts In-Stock

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$3.010

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Digiode

USA . 3,039 parts In-Stock

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$3.430

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$3.430

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Flip Electronics

USA . 2,130 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 1,621 parts In-Stock

1+ parts

$2.560

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1,621

$2.560

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Corohmni

South Africa . 394 parts In-Stock

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$3.010

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394

$3.010

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Corphita

USA . 777 parts In-Stock

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$3.249

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777

$3.249

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Component Stockers USA

USA . 2,184 parts In-Stock

1+ parts

$3.740

100+ parts

$3.510

1k+ parts

$3.170

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2,184

$3.740

$3.510

$3.170

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Andel Nordic

Denmark . 32 parts In-Stock

1+ parts

$8.074

100+ parts

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$7.752

10k+ parts

$7.752

32

$8.074

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$7.752

$7.752

Microchip USA

USA . 186 parts In-Stock

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$17.304

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 8,222 parts In-Stock

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Kulean Microsystems

USA . 6,605 parts In-Stock

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SupplyDigital Components

Austria . 5,972 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Kepictronics

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TANS Electronics

Latvia . 1,361 parts In-Stock

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Supply Digital

USA . 544 parts In-Stock

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Northwest PG Solutions

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Authorized Procurement Solutions

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Native Components

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UHIMA Technologies

Türkiye . 4 parts In-Stock

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Overview

Looking to enhance your power switching applications? Look no further than the FQA90N15-F109 by Onsemi. With a reputation for quality and reliability, Onsemi's Power Field Effect Transistors deliver exceptional performance and durability. The FQA90N15-F109 offers a wide range of benefits, including high efficiency, fast switching speeds, and low on-resistance. Whether you're in need of power management solutions for automotive, industrial, or consumer electronics, this N-CHANNEL FET with built-in diode is the perfect choice. Trust Onsemi to power up your projects with cutting-edge technology and unmatched value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to external elements, ensuring the longevity of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-efficiency applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in high-frequency switching circuits.

No. of Terminals: 3

The three terminal configuration allows for easy integration into existing circuitry, simplifying installation and usage.

Maximum Power Dissipation (Abs): 375 W

With a high power dissipation rating, this FET can handle high voltage and current loads without overheating, ensuring continuous operation under heavy loads.

Maximum Operating Temperature: 175 °C

The high operating temperature range ensures reliable performance even in harsh environments, making it suitable for industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) FQA90N15-F109 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1400 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.018 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA90N15-F109 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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