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FQA9N90C-F109

Onsemi

FQA9N90C-F109 by Onsemi

FQA9N90C-F109 by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 36A and EAS of 900mJ, making it suitable for high-power operations. With a max power dissipation of 280W and operating temperature up to 150°C, this transistor offers reliable performance in various industrial settings.

Median Price

$1.946

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 12,289 parts In-Stock

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Verical

USA . 900 parts In-Stock

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$2.462

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900

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$2.462

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Rochester

USA . 63 parts In-Stock

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$1.430

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$1.280

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$1.200

63

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$1.430

$1.280

$1.200

Distributors (In-Stock)

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Digiode

USA . 388 parts In-Stock

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$1.976

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388

$1.976

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Nova Conductors

Japan . 515 parts In-Stock

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$2.432

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515

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A&K Electronics

USA . 8,440 parts In-Stock

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Chip Stock

USA . 7,240 parts In-Stock

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Flip Electronics

USA . 6,654 parts In-Stock

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Vyrian

USA . 2,635 parts In-Stock

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Rotakorn

Sweden . 900 parts In-Stock

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900

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NAC Semi

USA . 150 parts In-Stock

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$2.840

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$2.630

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Bristol Electronics

USA . 30 parts In-Stock

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30

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Distributors (Availability)

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Decca Corp

Germany . 6,294 parts In-Stock

1+ parts

$1.590

100+ parts

$1.558

1k+ parts

$1.543

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6,294

$1.590

$1.558

$1.543

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Aztec Data Supply Inc.

USA . 276 parts In-Stock

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$1.704

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276

$1.704

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Ampacity Inc.

Singapore . 11,654 parts In-Stock

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$1.770

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11,654

$1.770

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Semicontronic

India . 6,205 parts In-Stock

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$1.770

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$1.726

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$1.717

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6,205

$1.770

$1.726

$1.717

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Corphita

USA . 1,344 parts In-Stock

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$1.872

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$1.872

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Corohmni

South Africa . 442 parts In-Stock

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$2.080

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442

$2.080

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Component Stockers USA

USA . 138 parts In-Stock

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$2.150

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$2.650

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138

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Netroflash

USA . 1,000 parts In-Stock

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$2.432

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$2.432

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Andel Nordic

Denmark . 369 parts In-Stock

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$11.071

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$10.628

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$10.628

369

$11.071

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$10.628

AZTECH Wire

Italy . 741 parts In-Stock

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$11.560

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741

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Kepictronics

USA . 45,000 parts In-Stock

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RC Electronics

USA . 35,395 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

Germany . 11,243 parts In-Stock

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TANS Electronics

Latvia . 8,179 parts In-Stock

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Advanced Electronics

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Argo Parts USA

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Austria . 5,532 parts In-Stock

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Kulean Microsystems

USA . 5,319 parts In-Stock

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Continental Prestige Electronics

USA . 5,183 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,595 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 850 parts In-Stock

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Perfect Parts

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Problanco Electronics

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Eastek

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GreenTree Electronics

Israel . 180 parts In-Stock

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Overview

Unlock the power of efficiency and reliability with the FQA9N90C-F109 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality power field effect transistors (FET) for various applications. With its N-channel configuration, built-in diode, and 900V breakdown voltage, this transistor is perfect for switching operations. Experience enhanced performance and durability with a maximum power dissipation of 280W and a puls ed drain current of 36A. Trust Onsemi to provide you with the value and benefits you need for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making the FET suitable for various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility and lower resistance, offering improved performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances efficiency and simplifies circuit design, making this FET a convenient choice for applications requiring reverse current protection.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast response times and high efficiency, ideal for controlling power flow in electronic devices.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can withstand voltage spikes and surges, ensuring reliability in high-voltage applications.

Package Shape: RECTANGULAR

The rectangular shape provides easy mounting and integration, making it suitable for space-constrained environments.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer secure connections and easy soldering, ensuring reliable and stable performance in various circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer simplified control and operation, making them suitable for applications where ease of use and efficiency are important.

Maximum Pulsed Drain Current (IDM): 36 A

The high pulsed drain current rating allows the FET to handle sudden current spikes, making it suitable for demanding applications that require high power output.

Avalanche Energy Rating (EAS): 900 mJ

The high avalanche energy rating ensures the FET can withstand energy spikes, making it reliable and durable in harsh operating conditions.

Maximum Power Dissipation (Abs): 280 W

With a high power dissipation rating, this FET can handle heat dissipation effectively, ensuring reliable performance in high-power applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers secure mounting and thermal management, making it suitable for applications that require efficient heat dissipation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low gate capacitance, making this FET ideal for high-performance applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate reliably in extreme temperature conditions, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon transistors offer high thermal conductivity and reliability, ensuring long-term performance and stability in various applications.

Maximum Drain-Source On Resistance: 1.4 ohm

The low on-resistance minimizes power loss and heat generation, improving efficiency and performance in power control applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and wiring, making this FET easy to integrate into various circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) FQA9N90C-F109 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

900 mJ

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

36 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA9N90C-F109 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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