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FQA90N08

Onsemi

FQA90N08 by Onsemi

FQA90N08 by Onsemi is a N-CHANNEL Power FET with 80V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 90A, 0.016 ohm Drain-Source Resistance, and 214W Power Dissipation. The transistor operates in ENHANCEMENT MODE and has a package style of FLANGE MOUNT.

Median Price

$3.115

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 56 parts In-Stock

1+ parts

$4.780

100+ parts

$2.650

1k+ parts

-

10k+ parts

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56

$4.780

$2.650

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Mouser Electronics

USA . 127 parts In-Stock

1+ parts

$5.210

100+ parts

$3.540

1k+ parts

$2.600

10k+ parts

$2.360

127

$5.210

$3.540

$2.600

$2.360

Rochester

USA . 1,360 parts In-Stock

1+ parts

-

100+ parts

$1.290

1k+ parts

$1.160

10k+ parts

$1.090

1,360

-

$1.290

$1.160

$1.090

Verical

USA . 910 parts In-Stock

1+ parts

-

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$1.450

10k+ parts

$1.363

910

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-

$1.450

$1.363

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,198 parts In-Stock

1+ parts

$1.748

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2,198

$1.748

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Nova Conductors

Japan . 15 parts In-Stock

1+ parts

$2.882

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15

$2.882

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Chip Stock

USA . 79,000 parts In-Stock

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79,000

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Vyrian

USA . 159 parts In-Stock

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159

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Distributors (Availability)

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Ampacity Inc.

Singapore . 496 parts In-Stock

1+ parts

$1.560

100+ parts

-

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496

$1.560

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Corphita

USA . 2,160 parts In-Stock

1+ parts

$1.656

100+ parts

-

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2,160

$1.656

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Corohmni

South Africa . 395 parts In-Stock

1+ parts

$1.840

100+ parts

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395

$1.840

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Component Stockers USA

USA . 329 parts In-Stock

1+ parts

$1.880

100+ parts

$1.760

1k+ parts

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329

$1.880

$1.760

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Aranea Global

USA . 100 parts In-Stock

1+ parts

$2.825

100+ parts

-

1k+ parts

$2.712

10k+ parts

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100

$2.825

-

$2.712

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Continental Prestige Electronics

USA . 5,347 parts In-Stock

1+ parts

$2.882

100+ parts

-

1k+ parts

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10k+ parts

$2.825

5,347

$2.882

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-

$2.825

Argo Parts USA

USA . 3,414 parts In-Stock

1+ parts

$2.882

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3,414

$2.882

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Microchip USA

USA . 354 parts In-Stock

1+ parts

$21.645

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354

$21.645

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A-Z Elektronik GmbH

Germany . 7,553 parts In-Stock

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7,553

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SupplyDigital Components

Austria . 7,188 parts In-Stock

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7,188

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TANS Electronics

Latvia . 2,776 parts In-Stock

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2,776

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Perfect Parts

USA . 2,016 parts In-Stock

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2,016

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Problanco Electronics

Mexico . 1,856 parts In-Stock

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1,856

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Kulean Microsystems

USA . 1,604 parts In-Stock

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1,604

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Alle Elektronik GmbH

Germany . 1,135 parts In-Stock

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1,135

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Kepictronics

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 440 parts In-Stock

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440

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Supply Digital

USA . 272 parts In-Stock

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272

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Overview

Discover the power of the FQA90N08 by Onsemi, a top-of-the-line Power Field Effect Transistor designed for switching applications. Manufactured with precision and expertise by Onsemi, this N-channel transistor offers unparalleled quality and reliability. With a maximum drain current of 90A and a low on-resistance of 0.016 ohm, this transistor provides exceptional performance and efficiency. Whether you're looking to enhance your electronic devices or improve energy efficiency, the FQA90N08 is the perfect choice. Upgrade your projects with this high-quality component and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher switching speeds compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse voltage.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it ideal for use in power control circuits.

Minimum DS Breakdown Voltage: 80 V

With a high breakdown voltage, this FET can handle higher voltages without damage.

Maximum Power Dissipation (Abs): 214 W

The high power dissipation rating ensures that the FET can handle high power loads without overheating.

Maximum Drain Current (ID): 90 A

Capable of handling high current levels, making it suitable for a wide range of applications.

Maximum Drain-Source On Resistance: 0.016 ohm

Low on-resistance leads to lower power losses and improved efficiency in the circuit.

Maximum Operating Temperature: 175 °C

Can operate at elevated temperatures without performance degradation, suitable for high temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) FQA90N08 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1360 mJ

Minimum DS Breakdown Voltage:

80 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.016 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

360 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA90N08 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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