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FQA28N50F

Onsemi

FQA28N50F by Onsemi

FQA28N50F by Onsemi is a Power FET with N-CHANNEL polarity, 500V DS breakdown voltage, and 113.6A max pulsed drain current. Ideal for switching applications, it features a single configuration with built-in diode in a plastic/epoxy package suitable for through-hole mounting.

Median Price

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Lifecycle Status

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7

In-Stock Inventory

1k+

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Chip Stock

USA . 3,730 parts In-Stock

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Digiode

USA . 2,313 parts In-Stock

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Vyrian

USA . 1,426 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Classic Components Corporation

USA . 150 parts In-Stock

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Sunrise Surplus Inc.

USA . 12 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Andel Nordic

Denmark . 500 parts In-Stock

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$8.960

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$8.601

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$8.601

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$8.960

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$8.601

$8.601

AZTECH Wire

Italy . 223 parts In-Stock

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$19.786

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Ampacity Inc.

Singapore . 1,288 parts In-Stock

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$50.050

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 22,495 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,605 parts In-Stock

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Kulean Microsystems

USA . 6,650 parts In-Stock

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Continental Prestige Electronics

USA . 4,962 parts In-Stock

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TANS Electronics

Latvia . 4,925 parts In-Stock

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Problanco Electronics

Mexico . 4,096 parts In-Stock

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Authorized Procurement Solutions

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Corphita

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Alle Elektronik GmbH

Germany . 1,170 parts In-Stock

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UHIMA Technologies

Türkiye . 965 parts In-Stock

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S.R.D Solutions

India . 500 parts In-Stock

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Supply Digital

USA . 326 parts In-Stock

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SupplyDigital Components

Austria . 321 parts In-Stock

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Bastille Electronics

Australia . 300 parts In-Stock

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Argo Parts USA

USA . 226 parts In-Stock

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Corohmni

South Africa . 169 parts In-Stock

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Overview

Unleash the power of innovation with the FQA28N50F by Onsemi. Crafted with precision and cutting-edge technology, this Power Field Effect Transistor is a game-changer in the realm of switching applications. With a maximum pulsing drain current of 113.6 A and an impressive breakdown voltage of 500 V, this N-CHANNEL transistor offers unparalleled performance and reliability. Whether you're looking to optimize your system's efficiency or enhance its functionality, the FQA28N50F delivers the perfect balance of power and control. Say goodbye to limitations and hello to endless possibilities with this revolutionary product from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material, making the product easy to handle and install.

Polarity or Channel Type: N-CHANNEL

N-channel FETs tend to have better performance and efficiency compared to P-channel FETs, making this product a good choice for many applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Minimum DS Breakdown Voltage: 500 V

High breakdown voltage allows for safe and reliable operation even in high voltage applications.

Maximum Pulsed Drain Current (IDM): 113.6 A

Capable of handling high current pulses, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 310 W

High power dissipation rating ensures reliability under high load conditions.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for industrial environments.

Technical Specifications

Power Field Effect Transistors (FET) FQA28N50F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

28.4 A

Maximum Drain Current (ID):

28.4 A

Maximum Drain-Source On Resistance:

.16 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

113.6 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA28N50F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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