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FQA24N60

Onsemi

FQA24N60 by Onsemi

FQA24N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features 94A IDM, 1300mJ EAS, and 0.24ohm RDS(ON). With a max power dissipation of 310W and operating temperature up to 150°C, it's suitable for high-power circuits.

Median Price

$5.440

Lifecycle Status

Suppliers In-Stock

20

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 193 parts In-Stock

1+ parts

$4.620

100+ parts

$3.990

1k+ parts

-

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193

$4.620

$3.990

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Arrow

USA . 4,341 parts In-Stock

1+ parts

$4.760

100+ parts

$4.712

1k+ parts

$4.175

10k+ parts

-

4,341

$4.760

$4.712

$4.175

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Farnell

UK . 659 parts In-Stock

1+ parts

$6.320

100+ parts

$4.090

1k+ parts

$4.020

10k+ parts

-

659

$6.320

$4.090

$4.020

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Newark

USA . 548 parts In-Stock

1+ parts

$8.240

100+ parts

$4.990

1k+ parts

$4.880

10k+ parts

-

548

$8.240

$4.990

$4.880

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Mouser Electronics

USA . 367 parts In-Stock

1+ parts

$8.810

100+ parts

-

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367

$8.810

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Element14

Singapore . 659 parts In-Stock

1+ parts

$10.780

100+ parts

$6.860

1k+ parts

$6.730

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659

$10.780

$6.860

$6.730

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Rochester

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

$4.130

1k+ parts

$3.700

10k+ parts

$3.480

6,720

-

$4.130

$3.700

$3.480

DigiKey

USA . 6,720 parts In-Stock

1+ parts

-

100+ parts

$5.440

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6,720

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$5.440

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Verical

USA . 6,170 parts In-Stock

1+ parts

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100+ parts

$5.162

1k+ parts

$4.625

10k+ parts

$4.350

6,170

-

$5.162

$4.625

$4.350

Future Electronics

Canada . 330 parts In-Stock

1+ parts

-

100+ parts

$3.960

1k+ parts

$3.900

10k+ parts

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330

-

$3.960

$3.900

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EBV Elektronik

Germany . 90 parts In-Stock

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90

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RS (Exports)

UK . 3 parts In-Stock

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-

100+ parts

$5.551

1k+ parts

$4.815

10k+ parts

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3

-

$5.551

$4.815

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 66 parts In-Stock

1+ parts

$3.303

100+ parts

-

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66

$3.303

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Digiode

USA . 1,701 parts In-Stock

1+ parts

$4.322

100+ parts

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1,701

$4.322

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TME

Poland . 91 parts In-Stock

1+ parts

$7.360

100+ parts

$5.790

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91

$7.360

$5.790

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Chip Stock

USA . 4,500 parts In-Stock

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4,500

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Vyrian

USA . 2,004 parts In-Stock

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2,004

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IBS Electronics

USA . 330 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.070

10k+ parts

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330

-

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$5.070

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Flip Electronics

USA . 300 parts In-Stock

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300

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NAC Semi

USA . 180 parts In-Stock

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$23.240

1k+ parts

$21.120

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180

-

$23.240

$21.120

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 146 parts In-Stock

1+ parts

$3.237

100+ parts

-

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146

$3.237

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$3.303

100+ parts

$3.237

1k+ parts

-

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2,000

$3.303

$3.237

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Argo Parts USA

USA . 1,828 parts In-Stock

1+ parts

$3.303

100+ parts

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1,828

$3.303

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Ampacity Inc.

Singapore . 1,930 parts In-Stock

1+ parts

$3.870

100+ parts

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1,930

$3.870

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Corphita

USA . 1,129 parts In-Stock

1+ parts

$4.095

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1,129

$4.095

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Continental Prestige Electronics

USA . 513 parts In-Stock

1+ parts

$6.660

100+ parts

$4.570

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513

$6.660

$4.570

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Perfect Parts

USA . 144,446 parts In-Stock

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144,446

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Authorized Procurement Solutions

USA . 33,240 parts In-Stock

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33,240

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QUARKTWIN TECHNOLOGY LTD

USA . 15,991 parts In-Stock

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15,991

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GreenTree Electronics

Israel . 15,300 parts In-Stock

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15,300

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RC Electronics

USA . 9,822 parts In-Stock

1+ parts

-

100+ parts

$4.240

1k+ parts

$3.870

10k+ parts

$3.750

9,822

-

$4.240

$3.870

$3.750

Microchip USA

USA . 7,095 parts In-Stock

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7,095

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Problanco Electronics

Mexico . 7,016 parts In-Stock

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7,016

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TANS Electronics

Latvia . 6,346 parts In-Stock

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6,346

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Kulean Microsystems

USA . 5,842 parts In-Stock

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5,842

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Metaverse IC Inc.

Canada . 3,600 parts In-Stock

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3,600

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SupplyDigital Components

Austria . 2,915 parts In-Stock

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2,915

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A-Z Elektronik GmbH

Germany . 2,366 parts In-Stock

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2,366

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S.R.D Solutions

India . 2,000 parts In-Stock

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2,000

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Supply Digital

USA . 1,868 parts In-Stock

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1,868

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Alle Elektronik GmbH

Germany . 1,577 parts In-Stock

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1,577

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Kepictronics

USA . 1,000 parts In-Stock

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1,000

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Infinite Electronics LLP (Excess)

. 702 parts In-Stock

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702

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UHIMA Technologies

Türkiye . 242 parts In-Stock

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242

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Glotronic Ltd.

UK . 56 parts In-Stock

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56

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Overview

Enhance your power management capabilities with the FQA24N60 by Onsemi, a top-quality Power FET designed for switching applications. Manufactured by Onsemi, a trusted leader in semiconductor technology, this N-channel transistor offers a built-in diode for seamless operation. With a high breakdown voltage of 600V and a maximum drain current of 23.5A, this transistor delivers reliable performance and enhanced efficiency. Whether you're looking to optimize your power supply design or improve system reliability, the FQA24N60 is the ideal solution for your application needs. Unlock the potential of your power systems with this cutting-edge component from Onsemi.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - Provides durability and protection for the FET, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - Allows for efficient current flow, enhancing the performance of the FET in switching applications.

Configuration:

SINGLE WITH BUILT-IN DIODE - Simplifies circuit design and saves space, making it suitable for compact electronic devices.

Transistor Application:

SWITCHING - Designed specifically for switching tasks, ensuring fast response times and high efficiency.

Minimum DS Breakdown Voltage:

600 V - Provides a high level of voltage protection, making it suitable for use in power circuits.

Package Shape:

RECTANGULAR - Facilitates easy integration into electronic systems, enhancing overall design flexibility.

Terminal Form:

THROUGH-HOLE - Offers secure connections and ease of soldering, ideal for through-hole PCB assembly.

Operating Mode:

ENHANCEMENT MODE - Enables precise control of the FET's conductivity, ensuring optimal performance in various applications.

Maximum Pulsed Drain Current (IDM):

94 A - Can handle high current surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS):

1300 mJ - Provides robust protection against voltage spikes, increasing the reliability of the FET.

Maximum Drain Current (Abs) (ID):

23.5 A - Allows for continuous high current operation, making it suitable for power-hungry devices.

No. of Terminals:

3 - Simplifies circuit connections, offering a straightforward integration process.

Maximum Power Dissipation (Abs):

310 W - Can dissipate heat efficiently, ensuring stable operation under high power conditions.

Package Style (Meter):

FLANGE MOUNT - Enables easy mounting and heat dissipation, enhancing the overall reliability of the FET.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Offers high efficiency and reliability, making it a preferred choice for various applications.

Maximum Operating Temperature:

150 °C - Can operate at high temperatures, suitable for demanding industrial environments.

Transistor Element Material:

SILICON - Provides excellent electrical properties and reliability, ensuring long-term performance.

Terminal Finish:

Matte Tin (Sn) - annealed - Ensures reliable connections, preventing oxidation and improving long-term performance.

Maximum Drain-Source On Resistance:

0.24 ohm - Offers low resistance for efficient power flow, improving the overall efficiency of the FET.

Terminal Position:

SINGLE - Facilitates easy installation and connections, simplifying the overall circuit design process.

Technical Specifications

Power Field Effect Transistors (FET) FQA24N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1300 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

23.5 A

Maximum Drain Current (ID):

23.5 A

Maximum Drain-Source On Resistance:

.24 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

94 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQA24N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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