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FDS5680

Onsemi

FDS5680 by Onsemi

FDS5680 by Onsemi is an N-CHANNEL power FET with a min DS breakdown voltage of 60V. It is used for switching applications and has a max drain current of 8A.

Median Price

$0.659

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,000 parts In-Stock

1+ parts

$0.659

100+ parts

$0.619

1k+ parts

$0.560

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5,000

$0.659

$0.619

$0.560

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Flip Electronics (Authorized)

USA . 212,500 parts In-Stock

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Digiode

USA . 1,345 parts In-Stock

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$0.626

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1,345

$0.626

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Nova Conductors

Japan . 97 parts In-Stock

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$0.970

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97

$0.970

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Mobius Materials

USA . 750 parts In-Stock

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$4.230

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$3.380

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750

$4.230

$3.380

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Flip Electronics

USA . 177,500 parts In-Stock

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177,500

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Vyrian

USA . 108,399 parts In-Stock

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108,399

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Chip Stock

USA . 10,439 parts In-Stock

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Sensible Micro Corp

USA . 1,290 parts In-Stock

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1,290

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Zilex Electronics Inc.

Canada . 1,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 466 parts In-Stock

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466

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LIBRA Elektronik GmbH

Germany . 185 parts In-Stock

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185

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Tectiva GmbH

Germany . 100 parts In-Stock

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100

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Speed Components Ltd

Israel . 79 parts In-Stock

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79

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HZD GmbH

Germany . 74 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 9,321 parts In-Stock

1+ parts

$0.443

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9,321

$0.443

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Ampacity Inc.

Singapore . 108,585 parts In-Stock

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$0.560

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108,585

$0.560

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Semicontronic

India . 108,413 parts In-Stock

1+ parts

$0.560

100+ parts

$0.546

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$0.543

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108,413

$0.560

$0.546

$0.543

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Corphita

USA . 1,302 parts In-Stock

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$0.593

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1,302

$0.593

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Corohmni

South Africa . 204 parts In-Stock

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$0.659

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204

$0.659

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Argo Parts USA

USA . 4,667 parts In-Stock

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$0.877

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4,667

$0.877

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Aranea Global

USA . 100 parts In-Stock

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$0.950

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$0.912

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100

$0.950

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$0.912

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Aztec Data Supply Inc.

USA . 4,065 parts In-Stock

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$1.149

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4,065

$1.149

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.340

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$1.273

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$1.273

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270

$1.340

$1.273

$1.273

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Modulus Dynamics

Lithuania . 10,365 parts In-Stock

1+ parts

$1.955

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$1.955

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$1.955

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10,365

$1.955

$1.955

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Microchip USA

USA . 116 parts In-Stock

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$4.110

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GreenTree Electronics

Israel . 217,500 parts In-Stock

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RC Electronics

USA . 45,089 parts In-Stock

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$1.030

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$0.940

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$0.910

45,089

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$1.030

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$0.910

Perfect Parts

USA . 40,132 parts In-Stock

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SupplyDigital Components

Austria . 7,353 parts In-Stock

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TANS Electronics

Latvia . 7,335 parts In-Stock

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Authorized Procurement Solutions

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Infinite Electronics LLP (Excess)

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Kepictronics

USA . 1,943 parts In-Stock

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Supply Digital

USA . 1,745 parts In-Stock

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Problanco Electronics

Mexico . 1,744 parts In-Stock

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Kulean Microsystems

USA . 1,087 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 250 parts In-Stock

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iodParts Technologies Inc.

India . 14 parts In-Stock

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Overview

Discover the power and reliability of the FDS5680 by Onsemi. As a leading manufacturer in the industry, Onsemi offers exceptional quality and innovation in their products. The FDS5680 is a Power Field Effect Transistor (FET) with N-CHANNEL polarity, making it ideal for switching applications. With its built-in diode and small outline package style, this transistor provides enhanced performance and convenience. Experience the benefits of a maximum DS breakdown voltage of 60V, maximum drain current of 8A, and low drain-source on resistance of 0.02 ohm. Whether you're in need of efficient power switching or reliable performance, the FDS5680 has got you covered. Trust Onsemi for superior technology that meets your needs.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the internal components, making this product suitable for various applications.

Polarity or Channel Type:

N-CHANNEL - The N-channel polarity allows for efficient and reliable switching, enhancing the overall performance of the product.

Configuration:

SINGLE WITH BUILT-IN DIODE - This configuration simplifies circuit design and allows for the integration of a diode, enhancing convenience and reducing the need for additional components.

Transistor Application:

SWITCHING - With a specific focus on switching applications, this product offers high-speed performance and precise control.

Surface Mount:

YES - The surface mount capability enables easy installation and saves space, making this product suitable for compact designs.

Minimum DS Breakdown Voltage:

60 V - The high minimum breakdown voltage ensures safe operation and protection against excessive voltage, offering reliability and longevity.

Package Shape:

RECTANGULAR - The rectangular shape allows for efficient placement on circuit boards, optimizing space utilization.

Terminal Form:

GULL WING - The gull wing terminal form facilitates soldering and ensures strong and secure connections.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation provides low power consumption and improves efficiency, making this product energy-efficient.

No. of Elements:

1 - With a single element, this product offers simplicity and ease of use in various applications.

Maximum Pulsed Drain Current (IDM):

50 A - The high maximum pulsed drain current allows for handling momentary high current surges, ensuring stability and reliability.

Maximum Drain Current (Abs) (ID):

8 A - The high maximum drain current ensures efficient power delivery and reliability in various applications.

No. of Terminals:

8 - With eight terminals, this product offers flexibility and compatibility with different circuit configurations.

Maximum Power Dissipation (Abs):

2.5 W - The high maximum power dissipation capability ensures efficient heat dissipation, improving overall product reliability.

Package Style (Meter):

SMALL OUTLINE - The small outline package style enables easy integration into compact designs, making this product suitable for space-constrained applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - The metal-oxide semiconductor technology offers low power consumption, high-speed performance, and reliability.

Maximum Operating Temperature:

150 °C - The high maximum operating temperature allows this product to withstand demanding and high-temperature environments, ensuring durability and stability.

Transistor Element Material:

SILICON - The silicon-based transistor element material provides excellent conductivity and reliability, making this product a dependable choice.

Maximum Turn On Time (ton):

40 ns - The low maximum turn-on time ensures fast response and precise switching, enhancing the performance of this product.

Minimum Operating Temperature:

55 °C - The low minimum operating temperature allows this product to perform reliably even in extreme cold conditions, making it suitable for various environments.

Maximum Turn Off Time (toff):

76 ns - The low maximum turn-off time ensures fast switching and reduces power loss, improving overall efficiency.

Terminal Finish:

Matte Tin (Sn) - annealed - The matte tin finish provides corrosion resistance, ensuring durability and maintaining optimal performance over time.

Maximum Drain-Source On Resistance:

0.02 ohm - The low maximum drain-source on resistance minimizes power loss and improves overall efficiency, making this product a reliable choice.

Terminal Position:

DUAL - The dual terminal position offers flexibility in circuit design and makes this product compatible with various application requirements.

Moisture Sensitivity Level (MSL):

1 - With a moisture sensitivity level of 1, this product is suitable for a wide range of environments and offers high reliability.

Maximum Feedback Capacitance (Crss):

100 pF - The low maximum feedback capacitance ensures stable and precise operation, delivering reliable performance in various applications.

Technical Specifications

Power Field Effect Transistors (FET) FDS5680 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

.02 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

100 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

50 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

76 ns

Maximum Turn On Time (ton):

40 ns

Trade Compliance

FDS5680 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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