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FDS5672

Onsemi

FDS5672 by Onsemi

FDS5672 by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 12A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a max power dissipation of 2.5W.

Median Price

$1.844

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 118 parts In-Stock

1+ parts

$1.357

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$0.788

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$0.788

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Element14

Singapore . 385 parts In-Stock

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$2.330

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$1.560

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$1.310

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385

$2.330

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$1.310

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Mouser Electronics

USA . 26,969 parts In-Stock

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$2.700

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$1.190

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$2.700

$1.190

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DigiKey

USA . 214 parts In-Stock

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$2.700

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$1.188

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$0.884

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$2.700

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$0.884

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Newark

USA . 16 parts In-Stock

1+ parts

$3.280

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$1.450

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$1.070

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16

$3.280

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$1.070

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Chip1Stop

Japan . 2,500 parts In-Stock

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$0.764

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Verical

USA . 446 parts In-Stock

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$1.198

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$0.866

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$1.198

$0.866

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Master Electronics

USA . 446 parts In-Stock

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$0.691

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$0.646

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$0.627

446

-

$0.691

$0.646

$0.627

Distributors (In-Stock)

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Nova Conductors

Japan . 85 parts In-Stock

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$0.877

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Digiode

USA . 1,438 parts In-Stock

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$1.046

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DF Sales Co.

USA . 11 parts In-Stock

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DF Sales Co.

USA . 11 parts In-Stock

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Chip Stock

USA . 53,500 parts In-Stock

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Vyrian

USA . 7,585 parts In-Stock

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Flip Electronics

USA . 4,150 parts In-Stock

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Bristol Electronics

USA . 2,235 parts In-Stock

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Atlantic Semiconductor

USA . 2,235 parts In-Stock

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Cyclops Electronics Ltd

UK . 2,097 parts In-Stock

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Electro Sonic

Canada . 1,696 parts In-Stock

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$0.744

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$0.675

1,696

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$0.675

IBS Electronics

USA . 1,696 parts In-Stock

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$0.923

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$0.860

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$0.832

1,696

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$0.860

$0.832

PC Components Company LLC

USA . 1,218 parts In-Stock

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ComSIT Distribution GmbH

Germany . 598 parts In-Stock

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Prism Electronics

USA . 96 parts In-Stock

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Semtec, LLC

USA . 2 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Distributors (Availability)

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Advanced Electronics

New Zealand . 40 parts In-Stock

1+ parts

$0.315

100+ parts

$0.299

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$0.299

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40

$0.315

$0.299

$0.299

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Semicontronic

India . 7,781 parts In-Stock

1+ parts

$0.600

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$0.585

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$0.582

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7,781

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$0.585

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Ampacity Inc.

Singapore . 7,670 parts In-Stock

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$0.600

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Corohmni

South Africa . 169 parts In-Stock

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$0.711

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Argo Parts USA

USA . 4,082 parts In-Stock

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$0.814

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Continental Prestige Electronics

USA . 3,440 parts In-Stock

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$0.814

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$0.798

3,440

$0.814

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$0.798

Netroflash

USA . 2,000 parts In-Stock

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$0.877

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$0.860

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$0.877

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Corphita

USA . 2,738 parts In-Stock

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$0.991

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Aztec Data Supply Inc.

USA . 1,663 parts In-Stock

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$1.591

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1,663

$1.591

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RC Electronics

USA . 91,888 parts In-Stock

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$0.840

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$0.770

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$0.740

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$0.840

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$0.740

Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 15,981 parts In-Stock

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Perfect Parts

USA . 14,000 parts In-Stock

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Lixinc

USA . 13,922 parts In-Stock

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Microchip USA

USA . 9,368 parts In-Stock

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Kulean Microsystems

USA . 7,580 parts In-Stock

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Kepictronics

USA . 7,451 parts In-Stock

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Authorized Procurement Solutions

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SupplyDigital Components

Austria . 4,107 parts In-Stock

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Problanco Electronics

Mexico . 3,958 parts In-Stock

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Futuretech Components

Singapore . 1,195 parts In-Stock

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UHIMA Technologies

Türkiye . 838 parts In-Stock

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Supply Digital

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TANS Electronics

Latvia . 87 parts In-Stock

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GreenTree Electronics

Israel . 5 parts In-Stock

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Overview

Elevate your power management solutions with the FDS5672 from Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor perfect for switching applications. With a maximum drain current of 12A and an operating temperature range of -55 to 150°C, this transistor offers unparalleled performance and reliability. Its small outline package design and built-in diode make it ideal for a wide range of applications, providing customers with efficient power control and enhanced functionality. Upgrade your projects with the FDS5672 and experience the benefits of superior quality and advanced technology from a trusted manufacturer like Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protects the internal components of the FET from external elements, ensuring a longer lifespan.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and provides reverse current protection, making this FET suitable for various switching applications.

Avalanche Energy Rating (EAS): 245 mJ

High avalanche energy rating allows the FET to withstand high energy spikes, providing better protection against voltage surges.

Maximum Drain Current (Abs) (ID): 12 A

High maximum drain current rating of 12 A allows the FET to handle higher loads, making it suitable for power switching applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C ensures the FET can operate in high temperature environments without overheating, enhancing its reliability.

Maximum Drain-Source On Resistance: 0.01 ohm

Low drain-source on resistance of 0.01 ohm minimizes power losses and improves efficiency in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FDS5672 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

245 mJ

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

130 pF

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

64 ns

Maximum Turn On Time (ton):

50 ns

Trade Compliance

FDS5672 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

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