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FDPF2710T

Onsemi

FDPF2710T by Onsemi

FDPF2710T by Onsemi is a N-CHANNEL Power FET with 250V DS Breakdown Voltage and 100A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode and 0.0425 ohm Drain-Source On Resistance. Operating in ENHANCEMENT MODE, it has a max power dissipation of 62.5W and can handle up to 150 °C temperature.

Median Price

$6.150

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 688 parts In-Stock

1+ parts

$6.150

100+ parts

$2.978

1k+ parts

$2.418

10k+ parts

-

688

$6.150

$2.978

$2.418

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Mouser Electronics

USA . 37 parts In-Stock

1+ parts

$6.150

100+ parts

$2.970

1k+ parts

$2.770

10k+ parts

-

37

$6.150

$2.970

$2.770

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Rochester

USA . 73 parts In-Stock

1+ parts

-

100+ parts

$2.410

1k+ parts

$2.160

10k+ parts

$2.030

73

-

$2.410

$2.160

$2.030

Distributors (In-Stock)

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Digiode

USA . 1,469 parts In-Stock

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1,469

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Vyrian

USA . 539 parts In-Stock

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539

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Chip Stock

USA . 145 parts In-Stock

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145

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Distributors (Availability)

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Native Components

USA . 476 parts In-Stock

1+ parts

$10.340

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476

$10.340

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Northwest PG Solutions

USA . 651 parts In-Stock

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$11.374

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$10.237

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651

$11.374

$10.237

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Microchip USA

USA . 3,666 parts In-Stock

1+ parts

$14.476

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3,666

$14.476

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Ampacity Inc.

Singapore . 1,143 parts In-Stock

1+ parts

$51.050

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1,143

$51.050

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iodParts Technologies Inc.

India . 50,000 parts In-Stock

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TANS Electronics

Latvia . 8,101 parts In-Stock

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SupplyDigital Components

Austria . 7,063 parts In-Stock

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7,063

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Problanco Electronics

Mexico . 6,629 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Perfect Parts

USA . 4,402 parts In-Stock

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Supply Digital

USA . 2,611 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Corphita

USA . 1,781 parts In-Stock

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1,781

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Component Stockers USA

USA . 1,614 parts In-Stock

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1,614

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Kulean Microsystems

USA . 1,040 parts In-Stock

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UHIMA Technologies

Türkiye . 827 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Overview

Enhance the performance of your electronic devices with the Onsemi FDPF2710T Power Field Effect Transistor. Manufactured by a trusted brand, this N-CHANNEL transistor boasts high quality and reliability. Ideal for switching applications, it offers a maximum drain current of 25A and a low drain-source on resistance of 0.0425 ohm. With a maximum power dissipation of 62.5W and an operating temperature up to 150 °C, this transistor provides excellent efficiency and durability. Upgrade your designs with the FDPF2710T for optimal performance and long-lasting results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and resistance to environmental factors, making the product suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

Offers efficient current handling and control, enhancing performance in switching applications.

Minimum DS Breakdown Voltage: 250 V

Provides a high level of voltage protection, ensuring reliability in high-power circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and offers added functionality with the built-in diode.

Maximum Pulsed Drain Current (IDM): 100 A

Allows for high current handling capabilities, suitable for demanding applications.

Maximum Power Dissipation (Abs): 62.5 W

Ensures efficient power handling and heat dissipation, enhancing overall performance.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without compromising performance, suitable for harsh environments.

Technical Specifications

Power Field Effect Transistors (FET) FDPF2710T attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

145 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

25 A

Maximum Drain Current (ID):

25 A

Maximum Drain-Source On Resistance:

.0425 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

100 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDPF2710T Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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