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FDMC86570L

Onsemi

FDMC86570L by Onsemi

FDMC86570L by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 200A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0043 ohm RDS(on), and 253mJ EAS rating. Operating in ENHANCEMENT MODE, this MOSFET has a max temp of 150°C and can handle up to 54W power dissipation.

Median Price

$3.790

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 14,996 parts In-Stock

1+ parts

$1.470

100+ parts

$1.380

1k+ parts

$1.250

10k+ parts

-

14,996

$1.470

$1.380

$1.250

-

Mouser Electronics

USA . 2,622 parts In-Stock

1+ parts

$3.790

100+ parts

$1.750

1k+ parts

$1.530

10k+ parts

$1.450

2,622

$3.790

$1.750

$1.530

$1.450

DigiKey

USA . 1,752 parts In-Stock

1+ parts

$3.790

100+ parts

$1.741

1k+ parts

$1.542

10k+ parts

$1.260

1,752

$3.790

$1.741

$1.542

$1.260

Newark

USA . 1,386 parts In-Stock

1+ parts

$3.790

100+ parts

-

1k+ parts

-

10k+ parts

-

1,386

$3.790

-

-

-

Element14

Singapore . 15 parts In-Stock

1+ parts

$3.860

100+ parts

$2.550

1k+ parts

$2.000

10k+ parts

$1.820

15

$3.860

$2.550

$2.000

$1.820

Farnell

UK . 15 parts In-Stock

1+ parts

-

100+ parts

$1.430

1k+ parts

$1.120

10k+ parts

$1.060

15

-

$1.430

$1.120

$1.060

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,302 parts In-Stock

1+ parts

$1.396

100+ parts

-

1k+ parts

-

10k+ parts

-

3,302

$1.396

-

-

-

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$1.530

-

-

-

Chip Stock

USA . 33,828 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

33,828

-

-

-

-

NAC Semi

USA . 6,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$1.830

6,000

-

-

-

$1.830

Vyrian

USA . 4,119 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,119

-

-

-

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Prism Electronics

USA . 3 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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3

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 132 parts In-Stock

1+ parts

$0.476

100+ parts

-

1k+ parts

-

10k+ parts

-

132

$0.476

-

-

-

Semicontronic

India . 4,297 parts In-Stock

1+ parts

$1.220

100+ parts

$1.190

1k+ parts

$1.183

10k+ parts

-

4,297

$1.220

$1.190

$1.183

-

Corphita

USA . 2,274 parts In-Stock

1+ parts

$1.323

100+ parts

-

1k+ parts

-

10k+ parts

-

2,274

$1.323

-

-

-

Component Stockers USA

USA . 30,083 parts In-Stock

1+ parts

$1.420

100+ parts

$1.330

1k+ parts

$1.210

10k+ parts

$1.210

30,083

$1.420

$1.330

$1.210

$1.210

Corohmni

South Africa . 106 parts In-Stock

1+ parts

$1.430

100+ parts

-

1k+ parts

-

10k+ parts

-

106

$1.430

-

-

-

Argo Parts USA

USA . 277 parts In-Stock

1+ parts

$1.530

100+ parts

-

1k+ parts

-

10k+ parts

-

277

$1.530

-

-

-

Ampacity Inc.

Singapore . 4,288 parts In-Stock

1+ parts

$2.650

100+ parts

-

1k+ parts

-

10k+ parts

-

4,288

$2.650

-

-

-

Microchip USA

USA . 8,785 parts In-Stock

1+ parts

$8.930

100+ parts

-

1k+ parts

-

10k+ parts

-

8,785

$8.930

-

-

-

RC Electronics

USA . 37,208 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.430

10k+ parts

$1.380

37,208

-

$1.560

$1.430

$1.380

Futuretech Components

Singapore . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,000

-

-

-

-

Perfect Parts

USA . 8,786 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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8,786

-

-

-

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Problanco Electronics

Mexico . 5,363 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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5,363

-

-

-

-

TANS Electronics

Latvia . 2,221 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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2,221

-

-

-

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Continental Prestige Electronics

USA . 1,970 parts In-Stock

1+ parts

-

100+ parts

$1.730

1k+ parts

$1.260

10k+ parts

-

1,970

-

$1.730

$1.260

-

SupplyDigital Components

Austria . 1,869 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,869

-

-

-

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Kulean Microsystems

USA . 1,681 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,681

-

-

-

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UHIMA Technologies

Türkiye . 620 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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620

-

-

-

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Bastille Electronics

Australia . 300 parts In-Stock

1+ parts

-

100+ parts

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300

-

-

-

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Supply Digital

USA . 181 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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181

-

-

-

-

Overview

Unleash the power of innovation with the FDMC86570L by Onsemi. This high-quality Power Field Effect Transistor is a game-changer in switching applications, offering unrivaled performance and reliability. With a maximum pulsed drain current of 200A and a minimum DS breakdown voltage of 60V, this N-channel transistor is designed to exceed your expectations. Whether you’re looking to optimize your power management system or enhance your electronic devices, the FDMC86570L delivers exceptional value and efficiency. Trust Onsemi to provide cutting-edge technology that empowers your projects to reach new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides good insulation and durability, making the product suitable for various environments.

Polarity or Channel Type:

N-CHANNEL - This type allows for efficient current flow and low power consumption, making the product energy-efficient.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode helps to prevent reverse current flow, ensuring proper functionality and protection of the circuit.

Transistor Application:

SWITCHING - Ideal for applications requiring high-speed switching, making the product versatile and suitable for a wide range of uses.

Surface Mount:

YES - The surface mount feature allows for easy installation and space-saving on the circuit board.

Minimum DS Breakdown Voltage:

60 V - With a high breakdown voltage, the product can handle higher voltages without malfunction, ensuring reliable performance.

Package Shape:

SQUARE - The square shape provides easy mounting and alignment, making the product user-friendly and convenient to work with.

Terminal Form:

NO LEAD - The absence of leads reduces the risk of short circuits and enhances the overall reliability of the product.

Operating Mode:

ENHANCEMENT MODE - This mode offers better control over the current flow, resulting in improved efficiency and performance of the product.

Maximum Pulsed Drain Current (IDM):

200 A - The high pulsed drain current capability allows for handling sudden surges in current without damaging the product.

Avalanche Energy Rating (EAS):

253 mJ - This rating indicates the product's ability to withstand energy spikes, ensuring longevity and durability.

Maximum Drain Current (Abs) (ID):

56 A - With a high drain current rating, the product can handle heavy loads, offering reliable operation under various conditions.

No. of Terminals:

5 - The multiple terminals provide flexibility in wiring and connectivity options, allowing for versatile use in different setups.

Maximum Power Dissipation (Abs):

54 W - The high power dissipation capacity ensures efficient heat management, preventing overheating and prolonging the product's lifespan.

Package Style (Meter):

SMALL OUTLINE - The small outline package style saves space and weight, making it suitable for compact applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - This advanced technology offers high reliability, low power consumption, and fast switching speeds, making the product a reliable choice.

Maximum Operating Temperature:

150 °C - With a high operating temperature range, the product can withstand harsh environmental conditions, ensuring durability and stable performance.

Transistor Element Material:

SILICON - Silicon offers excellent electrical properties, high thermal conductivity, and durability, making it a reliable choice for the product's construction.

Terminal Finish:

Matte Tin (Sn) - annealed - The matte tin finish provides corrosion resistance and ensures good solderability, enhancing the product's overall reliability.

Maximum Drain Current (ID):

18 A - The high drain current rating allows the product to handle heavy loads with ease, ensuring stable operation under demanding conditions.

Maximum Drain-Source On Resistance:

0.0043 ohm - The low on-resistance minimizes power loss and heat generation, improving the product's efficiency and performance.

Terminal Position:

DUAL - The dual terminal position offers flexibility in connections, making the product versatile and suitable for various circuit designs.

Case Connection:

DRAIN - The drain case connection simplifies the wiring process and enhances the product's overall usability.

Maximum Time At Peak Reflow Temperature (s):

30 - The maximum time at peak reflow temperature ensures proper soldering and reliability of the product during the manufacturing process.

Peak Reflow Temperature °C:

260 - The high peak reflow temperature capability allows for robust soldering, ensuring the product's longevity and performance.

Technical Specifications

Power Field Effect Transistors (FET) FDMC86570L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

253 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

56 A

Maximum Drain Current (ID):

18 A

Maximum Drain-Source On Resistance:

.0043 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMC86570L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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