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FDMC4D9P20X8

Onsemi

FDMC4D9P20X8 by Onsemi

FDMC4D9P20X8 by Onsemi is a P-CHANNEL Power FET with 20V DS Breakdown Voltage, 335A IDM, and 0.0049 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 40W.

Median Price

$0.898

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 93,101 parts In-Stock

1+ parts

-

100+ parts

$0.881

1k+ parts

$0.731

10k+ parts

$0.652

93,101

-

$0.881

$0.731

$0.652

Verical

USA . 87,700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.914

10k+ parts

$0.815

87,700

-

-

$0.914

$0.815

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,885 parts In-Stock

1+ parts

$0.687

100+ parts

-

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1,885

$0.687

-

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Flip Electronics

USA . 63,000 parts In-Stock

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63,000

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Chip Stock

USA . 8,300 parts In-Stock

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8,300

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Vyrian

USA . 8,071 parts In-Stock

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8,071

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ComSIT Distribution GmbH

Germany . 1,662 parts In-Stock

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1,662

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Distributors (Availability)

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Corphita

USA . 2,072 parts In-Stock

1+ parts

$0.651

100+ parts

-

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-

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2,072

$0.651

-

-

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Corohmni

South Africa . 289 parts In-Stock

1+ parts

$0.723

100+ parts

-

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-

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289

$0.723

-

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-

Component Stockers USA

USA . 1,340 parts In-Stock

1+ parts

$1.130

100+ parts

$0.720

1k+ parts

$0.490

10k+ parts

-

1,340

$1.130

$0.720

$0.490

-

AZTECH Wire

Italy . 581 parts In-Stock

1+ parts

$20.740

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581

$20.740

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Native Components

USA . 226 parts In-Stock

1+ parts

$261.060

100+ parts

$255.839

1k+ parts

$253.228

10k+ parts

$250.618

226

$261.060

$255.839

$253.228

$250.618

Northwest PG Solutions

USA . 221 parts In-Stock

1+ parts

$287.166

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221

$287.166

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Kulean Microsystems

USA . 8,286 parts In-Stock

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8,286

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SupplyDigital Components

Austria . 8,242 parts In-Stock

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TANS Electronics

Latvia . 7,582 parts In-Stock

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7,582

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Problanco Electronics

Mexico . 4,194 parts In-Stock

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4,194

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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2,500

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Perfect Parts

USA . 2,296 parts In-Stock

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2,296

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UHIMA Technologies

Türkiye . 624 parts In-Stock

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624

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Overview

Looking to power up your devices with efficiency and reliability? Look no further than the FDMC4D9P20X8 by Onsemi! As a leading manufacturer in the field of Power Field Effect Transistors (FET), Onsemi delivers top-notch quality and performance. With its P-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Enjoy enhanced functionality and durability with a maximum power dissipation of 40W and a maximum turn-off time of 781ns. Trust Onsemi to provide you with the cutting-edge technology you need to elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and reliability to the product.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high efficiency and low power consumption, making them suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode enhances the switching performance of the transistor and simplifies the circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in high-speed switching circuits.

Surface Mount: YES

The surface-mount capability allows for easy and space-efficient installation on PCBs, making it suitable for compact designs.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures protection against voltage spikes and overloads in the circuit.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides enhanced solderability and conductivity for secure and stable connections.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, the FET can perform reliably in high-temperature environments without overheating.

Technical Specifications

Power Field Effect Transistors (FET) FDMC4D9P20X8 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

54 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0049 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

1455 pF

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

335 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

781 ns

Maximum Turn On Time (ton):

54 ns

Trade Compliance

FDMC4D9P20X8 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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