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FDMC035N10X1

Onsemi

FDMC035N10X1 by Onsemi

FDMC035N10X1 by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage and 130A IDM. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. Operating in ENHANCEMENT MODE, it has a max power dissipation of 50W and operates b/w -55 to 150 °C.

Median Price

$0.559

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 17,356 parts In-Stock

1+ parts

-

100+ parts

$0.549

1k+ parts

$0.455

10k+ parts

$0.406

17,356

-

$0.549

$0.455

$0.406

Verical

USA . 13,969 parts In-Stock

1+ parts

-

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-

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$0.569

10k+ parts

$0.507

13,969

-

-

$0.569

$0.507

Distributors (In-Stock)

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Digiode

USA . 1,083 parts In-Stock

1+ parts

$0.428

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-

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1,083

$0.428

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Flip Electronics

USA . 56,998 parts In-Stock

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56,998

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Vyrian

USA . 2,590 parts In-Stock

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2,590

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Distributors (Availability)

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Corphita

USA . 1,161 parts In-Stock

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$0.405

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-

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1,161

$0.405

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Corohmni

South Africa . 305 parts In-Stock

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$0.450

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305

$0.450

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Native Components

USA . 55 parts In-Stock

1+ parts

$5.300

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55

$5.300

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AZTECH Wire

Italy . 283 parts In-Stock

1+ parts

$21.050

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283

$21.050

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Problanco Electronics

Mexico . 7,662 parts In-Stock

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Kulean Microsystems

USA . 6,553 parts In-Stock

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SupplyDigital Components

Austria . 5,382 parts In-Stock

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TANS Electronics

Latvia . 3,849 parts In-Stock

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Northwest PG Solutions

USA . 959 parts In-Stock

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$5.194

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959

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$5.194

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UHIMA Technologies

Türkiye . 958 parts In-Stock

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958

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Overview

Looking for a reliable and high-quality Power Field Effect Transistor (FET) for your switching applications? Look no further than the Onsemi FDMC035N10X1. With a maximum operating temperature of 150 °C and a minimum DS breakdown voltage of 100V, this N-CHANNEL transistor offers exceptional performance and durability. Its single configuration with built-in diode makes it ideal for a wide range of applications. Trust in Onsemi's reputation for superior manufacturing standards and choose the FDMC035N10X1 for all your power transistor needs. Experience the value and benefits this product brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient conduction of current in the desired direction.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies the circuit design by including a built-in diode for reverse current protection.

Transistor Application: SWITCHING

Optimized for switching applications, providing fast response times and efficient operation.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 100 V

Can handle high voltages, suitable for a variety of power applications.

Maximum Power Dissipation (Abs): 50 W

Can handle high power levels without overheating, ensuring reliability.

Maximum Operating Temperature: 150 °C

Capable of operating at high temperatures without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) FDMC035N10X1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

181 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240BA

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

130 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

115 ns

Maximum Turn On Time (ton):

34 ns

Trade Compliance

FDMC035N10X1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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