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FDBL9401-F085

Onsemi

FDBL9401-F085 by Onsemi

The Onsemi FDBL9401-F085 is a N-CHANNEL Power FET with 300A max drain current and 429W max power dissipation. Ideal for high-power applications, it operates at up to 175 °C and features METAL-OXIDE SEMICONDUCTOR technology. Suitable for surface mount configurations, it offers reliable performance in demanding environments.

Median Price

$1.990

Lifecycle Status

EOL

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

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3

$0.410

-

-

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Chip1Stop

Japan . 3 parts In-Stock

1+ parts

$2.830

100+ parts

-

1k+ parts

-

10k+ parts

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3

$2.830

-

-

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Rochester

USA . 45,580 parts In-Stock

1+ parts

-

100+ parts

$1.990

1k+ parts

$1.780

10k+ parts

$1.670

45,580

-

$1.990

$1.780

$1.670

Verical

USA . 43,247 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.325

10k+ parts

$2.188

43,247

-

-

$2.325

$2.188

Future Electronics

Canada . 8,000 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

$1.870

8,000

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-

-

$1.870

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,761 parts In-Stock

1+ parts

$0.390

100+ parts

-

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1,761

$0.390

-

-

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Vyrian

USA . 828 parts In-Stock

1+ parts

$0.410

100+ parts

-

1k+ parts

-

10k+ parts

-

828

$0.410

-

-

-

Bristol Electronics

USA . 20,000 parts In-Stock

1+ parts

$8.094

100+ parts

$3.804

1k+ parts

$3.480

10k+ parts

-

20,000

$8.094

$3.804

$3.480

-

Flip Electronics

USA . 3,416 parts In-Stock

1+ parts

-

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3,416

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Connect4Technologies Inc.

Canada . 64 parts In-Stock

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64

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Atlantic Semiconductor

USA . 27 parts In-Stock

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27

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Distributors (Availability)

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Native Components

USA . 646 parts In-Stock

1+ parts

$0.108

100+ parts

-

1k+ parts

-

10k+ parts

$0.104

646

$0.108

-

-

$0.104

Northwest PG Solutions

USA . 593 parts In-Stock

1+ parts

$0.119

100+ parts

-

1k+ parts

-

10k+ parts

$0.105

593

$0.119

-

-

$0.105

Corphita

USA . 1,580 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

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1,580

$0.369

-

-

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Corohmni

South Africa . 160 parts In-Stock

1+ parts

$0.410

100+ parts

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160

$0.410

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TANS Electronics

Latvia . 8,257 parts In-Stock

1+ parts

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8,257

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Perfect Parts

USA . 7,682 parts In-Stock

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7,682

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Problanco Electronics

Mexico . 6,289 parts In-Stock

1+ parts

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6,289

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QUARKTWIN TECHNOLOGY LTD

USA . 4,460 parts In-Stock

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4,460

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SupplyDigital Components

Austria . 4,125 parts In-Stock

1+ parts

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4,125

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Kulean Microsystems

USA . 4,070 parts In-Stock

1+ parts

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100+ parts

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4,070

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Supply Digital

USA . 2,259 parts In-Stock

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2,259

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Kepictronics

USA . 500 parts In-Stock

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500

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UHIMA Technologies

Türkiye . 355 parts In-Stock

1+ parts

-

100+ parts

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355

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-

Overview

Unleash the power of innovation with the FDBL9401-F085 from Onsemi, a leading manufacturer in Power Field Effect Transistors (FET). This N-CHANNEL transistor offers unparalleled performance and reliability, making it ideal for a wide range of applications. With a maximum drain current of 300A and a power dissipation of 429W, this transistor is designed to exceed expectations. Trust Onsemi for high-quality components that deliver exceptional value and benefits to your projects. Elevate your designs with the FDBL9401-F085 and experience the advantages of cutting-edge technology.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs have lower conduction losses compared to P-CHANNEL FETs, making them more efficient for power applications.

Configuration: SINGLE

SINGLE configuration simplifies circuit design and makes it easier to manage for users.

Surface Mount: YES

Surface mount technology allows for compact and space-saving designs, ideal for modern electronics.

Maximum Drain Current (ID): 300 A

High maximum drain current allows this FET to handle large amounts of power effectively.

Maximum Power Dissipation (P): 429 W

With a high maximum power dissipation, this FET can handle high-power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds and low switching losses, ideal for power control applications.

Maximum Operating Temperature: 175 °C

Operates efficiently at high temperatures, ensuring reliable performance in demanding environments.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, extending the product's lifespan.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for quick and efficient soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures during assembly, ensuring the FET's integrity and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FDBL9401-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

300 A

Maximum Drain Current (ID):

300 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

175 Cel

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

FDBL9401-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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