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FDB0260N1007L

Onsemi

FDB0260N1007L by Onsemi

FDB0260N1007L by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. It has a max IDM of 1100A and EAS of 912mJ, suitable for SWITCHING applications. Operating in ENHANCEMENT MODE, it features 0.0026 ohm Drain-Source On Resistance and can handle up to 200A Drain Current.

Median Price

$6.230

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 448 parts In-Stock

1+ parts

$5.530

100+ parts

$5.266

1k+ parts

$5.178

10k+ parts

-

448

$5.530

$5.266

$5.178

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Chip1Stop

Japan . 478 parts In-Stock

1+ parts

$6.230

100+ parts

-

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478

$6.230

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Element14

Singapore . 512 parts In-Stock

1+ parts

$10.453

100+ parts

$7.467

1k+ parts

$7.170

10k+ parts

$6.879

512

$10.453

$7.467

$7.170

$6.879

Mouser Electronics

USA . 457 parts In-Stock

1+ parts

$10.710

100+ parts

$6.180

1k+ parts

$5.040

10k+ parts

-

457

$10.710

$6.180

$5.040

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DigiKey

USA . 1,079 parts In-Stock

1+ parts

$10.730

100+ parts

$6.178

1k+ parts

$5.048

10k+ parts

-

1,079

$10.730

$6.178

$5.048

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Newark

USA . 679 parts In-Stock

1+ parts

$12.790

100+ parts

$8.290

1k+ parts

$7.880

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679

$12.790

$8.290

$7.880

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Farnell

UK . 2,335 parts In-Stock

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$5.680

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$5.680

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Rochester

USA . 2,285 parts In-Stock

1+ parts

-

100+ parts

$5.040

1k+ parts

$4.510

10k+ parts

$4.250

2,285

-

$5.040

$4.510

$4.250

Verical

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$5.079

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800

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-

$5.079

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,793 parts In-Stock

1+ parts

$5.254

100+ parts

-

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1,793

$5.254

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Flip Electronics

USA . 1,600 parts In-Stock

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1,600

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Vyrian

USA . 667 parts In-Stock

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667

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 5,654 parts In-Stock

1+ parts

$1.496

100+ parts

-

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5,654

$1.496

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$2.300

100+ parts

$2.093

1k+ parts

$1.886

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3,000

$2.300

$2.093

$1.886

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Ampacity Inc.

Singapore . 639 parts In-Stock

1+ parts

$4.480

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639

$4.480

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Corphita

USA . 1,785 parts In-Stock

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$4.977

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1,785

$4.977

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Corohmni

South Africa . 267 parts In-Stock

1+ parts

$5.610

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267

$5.610

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QUARKTWIN TECHNOLOGY LTD

USA . 18,657 parts In-Stock

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18,657

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Microchip USA

USA . 7,384 parts In-Stock

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SupplyDigital Components

Austria . 4,457 parts In-Stock

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4,457

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TANS Electronics

Latvia . 2,693 parts In-Stock

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2,693

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Continental Prestige Electronics

USA . 2,250 parts In-Stock

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Problanco Electronics

Mexico . 1,957 parts In-Stock

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Argo Parts USA

USA . 1,849 parts In-Stock

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Perfect Parts

USA . 1,792 parts In-Stock

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Supply Digital

USA . 1,387 parts In-Stock

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Kulean Microsystems

USA . 332 parts In-Stock

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UHIMA Technologies

Türkiye . 258 parts In-Stock

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Bastille Electronics

Australia . 32 parts In-Stock

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Overview

Power up your applications with the FDB0260N1007L by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in their power field effect transistors. Ideal for switching applications, this N-channel transistor offers a single configuration with a built-in diode, making it versatile and efficient. With a high voltage breakdown and low on-resistance, this transistor provides exceptional performance and durability. Trust Onsemi for all your power transistor needs and experience the value and benefits that the FDB0260N1007L brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and allows for better efficiency in switching applications.

Operating Mode: ENHANCEMENT MODE

Enhances control over the switching process, improving overall performance.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability allows for handling large loads and prevents overheating.

Maximum Operating Temperature: 175 °C

Can operate at high temperatures without compromising performance, ideal for industrial applications.

Maximum Drain-Source On Resistance: 0.0026 ohm

Low on-resistance ensures minimal power loss and efficient operation.

Technical Specifications

Power Field Effect Transistors (FET) FDB0260N1007L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

912 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

200 A

Maximum Drain Current (ID):

200 A

Maximum Drain-Source On Resistance:

.0026 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

65 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1100 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

115 ns

Maximum Turn On Time (ton):

94 ns

Trade Compliance

FDB0260N1007L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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