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FCPF250N65S3R0L

Onsemi

FCPF250N65S3R0L by Onsemi

FCPF250N65S3R0L by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 30A IDM, and 0.25 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 31W Power Dissipation and -55 to 150 °C temperature range.

Median Price

$1.060

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$1.770

100+ parts

$1.170

1k+ parts

$0.838

10k+ parts

$0.749

31

$1.770

$1.170

$0.838

$0.749

DigiKey

USA . 94,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.800

10k+ parts

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94,000

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$0.800

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Flip Electronics (Authorized)

USA . 94,000 parts In-Stock

1+ parts

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94,000

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Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$1.060

1k+ parts

$0.880

10k+ parts

$0.784

30

-

$1.060

$0.880

$0.784

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,664 parts In-Stock

1+ parts

$0.822

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1,664

$0.822

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Flip Electronics

USA . 94,000 parts In-Stock

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94,000

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Vyrian

USA . 7,830 parts In-Stock

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7,830

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

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Corphita

USA . 1,519 parts In-Stock

1+ parts

$0.778

100+ parts

-

1k+ parts

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1,519

$0.778

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Corohmni

South Africa . 53 parts In-Stock

1+ parts

$0.800

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53

$0.800

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Perfect Parts

USA . 9,383 parts In-Stock

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9,383

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Problanco Electronics

Mexico . 5,889 parts In-Stock

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SupplyDigital Components

Austria . 3,406 parts In-Stock

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3,406

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TANS Electronics

Latvia . 2,619 parts In-Stock

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2,619

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Kulean Microsystems

USA . 1,397 parts In-Stock

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1,397

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UHIMA Technologies

Türkiye . 666 parts In-Stock

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666

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Discover the exceptional quality and reliability of the FCPF250N65S3R0L by Onsemi, a leading manufacturer in the field. Designed for power switching applications, this N-channel power field effect transistor offers unmatched performance and efficiency. With a high breakdown voltage of 650V and a low on-resistance of 0.25 ohm, this transistor provides superior power handling capabilities. Whether you're in need of a reliable component for industrial machinery or renewable energy systems, this transistor is the perfect choice. Experience the value and benefits that Onsemi's FCPF250N65S3R0L brings to your projects today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

Offers efficient current flow in one direction, making it ideal for various applications such as switching.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by integrating a diode, saving space and reducing component count.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 650 V

Provides a high breakdown voltage, making the FET suitable for high voltage applications.

Package Shape: RECTANGULAR

Allows for easy mounting and placement in electronic circuits.

Terminal Form: THROUGH-HOLE

Enables secure connections to circuit boards, ensuring stability during operation.

Operating Mode: ENHANCEMENT MODE

Offers improved control over the FET's conductivity, enhancing its efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 30 A

Ability to handle high pulsed currents without overheating, ensuring reliable operation under peak loads.

Avalanche Energy Rating (EAS): 57 mJ

Can withstand energy spikes and surges, providing protection against electrical hazards.

Maximum Drain Current (Abs) (ID): 12 A

Offers sufficient current handling capacity for various applications, ensuring stability under normal operating conditions.

No. of Terminals: 3

Simple pin configuration for easy integration into circuit designs.

Maximum Power Dissipation (Abs): 31 W

High power dissipation capability allows the FET to operate under heavy load conditions without overheating.

Package Style (Meter): FLANGE MOUNT

Enables easy mounting on heat sinks for improved thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Reliable semiconductor technology that ensures stable performance over a wide range of operating conditions.

Maximum Operating Temperature: 150 °C

Operates effectively at high temperatures without compromising performance, suitable for demanding environments.

Transistor Element Material: SILICON

Silicon material offers high performance and reliability for long-term use.

Minimum Operating Temperature: -55 °C

Capable of operating in extreme cold conditions, ensuring versatility in various environments.

Terminal Finish: MATTE TIN

Corrosion-resistant finish for reliable electrical connections over time.

Maximum Drain-Source On Resistance: 0.25 ohm

Low on-resistance minimizes power losses and improves efficiency in switching applications.

Terminal Position: SINGLE

Simplified terminal layout for easy circuit integration.

Case Connection: ISOLATED

Isolation of the case connection enhances safety and reliability in circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) FCPF250N65S3R0L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF250N65S3R0L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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