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FCPF150N65F

Onsemi

FCPF150N65F by Onsemi

N-CHANNEL; Configuration: SINGLE WITH BUILT-IN DIODE; Surface Mount: NO; Maximum Power Dissipation (Abs): 39 W; Maximum Drain Current (Abs) (ID): 24 A; Avalanche Energy Rating (EAS): 663 mJ;

Median Price

$5.965

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,192 parts In-Stock

1+ parts

$2.920

100+ parts

$2.740

1k+ parts

$2.480

10k+ parts

-

1,192

$2.920

$2.740

$2.480

-

Mouser Electronics

USA . 948 parts In-Stock

1+ parts

$5.620

100+ parts

$3.070

1k+ parts

$2.860

10k+ parts

-

948

$5.620

$3.070

$2.860

-

DigiKey

USA . 990 parts In-Stock

1+ parts

$6.310

100+ parts

$3.064

1k+ parts

$2.501

10k+ parts

-

990

$6.310

$3.064

$2.501

-

Chip1Stop

Japan . 875 parts In-Stock

1+ parts

$15.400

100+ parts

$6.930

1k+ parts

$5.180

10k+ parts

-

875

$15.400

$6.930

$5.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,970 parts In-Stock

1+ parts

$2.774

100+ parts

-

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-

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1,970

$2.774

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-

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Vyrian

USA . 2,565 parts In-Stock

1+ parts

$2.920

100+ parts

-

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2,565

$2.920

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Flip Electronics

USA . 1,000 parts In-Stock

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1,000

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-

-

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NAC Semi

USA . 700 parts In-Stock

1+ parts

-

100+ parts

$5.720

1k+ parts

$5.280

10k+ parts

-

700

-

$5.720

$5.280

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 27 parts In-Stock

1+ parts

$2.078

100+ parts

-

1k+ parts

-

10k+ parts

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27

$2.078

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-

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Northwest PG Solutions

USA . 2,266 parts In-Stock

1+ parts

$2.286

100+ parts

-

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2,266

$2.286

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-

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Corphita

USA . 3,093 parts In-Stock

1+ parts

$2.628

100+ parts

-

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3,093

$2.628

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Corohmni

South Africa . 405 parts In-Stock

1+ parts

$2.920

100+ parts

-

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-

10k+ parts

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405

$2.920

-

-

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Component Stockers USA

USA . 1,608 parts In-Stock

1+ parts

$5.220

100+ parts

$3.210

1k+ parts

$2.580

10k+ parts

-

1,608

$5.220

$3.210

$2.580

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Microchip USA

USA . 8,544 parts In-Stock

1+ parts

$15.736

100+ parts

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8,544

$15.736

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Perfect Parts

USA . 4,284 parts In-Stock

1+ parts

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4,284

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TANS Electronics

Latvia . 4,136 parts In-Stock

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4,136

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Kulean Microsystems

USA . 2,039 parts In-Stock

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2,039

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Supply Digital

USA . 1,478 parts In-Stock

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1,478

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Problanco Electronics

Mexico . 1,394 parts In-Stock

1+ parts

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1,394

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GreenTree Electronics

Israel . 975 parts In-Stock

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975

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SupplyDigital Components

Austria . 953 parts In-Stock

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953

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Authorized Procurement Solutions

USA . 875 parts In-Stock

1+ parts

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875

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Kepictronics

USA . 100 parts In-Stock

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100

-

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UHIMA Technologies

Türkiye . 27 parts In-Stock

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27

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Technical Specifications

Power Field Effect Transistors (FET) FCPF150N65F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

663 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

24 A

Maximum Drain Current (ID):

24 A

Maximum Drain-Source On Resistance:

.15 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

72 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

178 ns

Maximum Turn On Time (ton):

106 ns

Trade Compliance

FCPF150N65F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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