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FCMT360N65S3

Onsemi

FCMT360N65S3 by Onsemi

FCMT360N65S3 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It has 25A IDM and 40mJ EAS ratings, operating in ENHANCEMENT MODE. With a max power dissipation of 83W and -55 to 150 °C temp range, it's suitable for high-power electronics.

Median Price

$2.522

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,518 parts In-Stock

1+ parts

$4.140

100+ parts

$2.270

1k+ parts

$1.990

10k+ parts

-

2,518

$4.140

$2.270

$1.990

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DigiKey

USA . 2,960 parts In-Stock

1+ parts

$4.800

100+ parts

$2.262

1k+ parts

$2.124

10k+ parts

$1.735

2,960

$4.800

$2.262

$2.124

$1.735

Flip Electronics (Authorized)

USA . 21,000 parts In-Stock

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Rochester

USA . 5,410 parts In-Stock

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$1.740

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$1.560

10k+ parts

$1.460

5,410

-

$1.740

$1.560

$1.460

Verical

USA . 5,410 parts In-Stock

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-

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$1.950

10k+ parts

$1.825

5,410

-

-

$1.950

$1.825

RS (Exports)

UK . 2,980 parts In-Stock

1+ parts

-

100+ parts

$2.522

1k+ parts

$2.393

10k+ parts

$2.332

2,980

-

$2.522

$2.393

$2.332

Distributors (In-Stock)

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Vyrian

USA . 1,443 parts In-Stock

1+ parts

$1.600

100+ parts

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1,443

$1.600

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Digiode

USA . 580 parts In-Stock

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$1.834

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580

$1.834

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Flip Electronics

USA . 21,000 parts In-Stock

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21,000

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Distributors (Availability)

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Corohmni

South Africa . 435 parts In-Stock

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$1.600

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435

$1.600

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Corphita

USA . 2,378 parts In-Stock

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$1.737

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$1.737

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Microchip USA

USA . 3,074 parts In-Stock

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$12.719

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3,074

$12.719

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QUARKTWIN TECHNOLOGY LTD

USA . 28,022 parts In-Stock

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Continental Prestige Electronics

USA . 5,410 parts In-Stock

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$2.320

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$2.320

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Problanco Electronics

Mexico . 5,115 parts In-Stock

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SupplyDigital Components

Austria . 3,856 parts In-Stock

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Kulean Microsystems

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TANS Electronics

Latvia . 3,115 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,679 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,786 parts In-Stock

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Northwest PG Solutions

USA . 1,133 parts In-Stock

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UHIMA Technologies

Türkiye . 667 parts In-Stock

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Native Components

USA . 66 parts In-Stock

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Overview

Unlock the power of innovation with the FCMT360N65S3 from Onsemi, a leading manufacturer in the industry. This Power FET is the ultimate solution for switching applications, offering unparalleled quality and reliability. With a built-in diode and a high DS Breakdown Voltage of 650V, this N-Channel transistor ensures optimal performance even in the most demanding environments. Say goodbye to inefficiency and hello to superior power management with this cutting-edge technology. Trust Onsemi to deliver excellence in every product, providing you with the tools you need to succeed.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the FET, ensuring longevity and reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better characteristics for high power applications and low on-resistance, making them suitable for efficient switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, ideal for efficient power control.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of failure or breakdown.

Maximum Drain Current (ID): 10 A

Capable of handling a high current, this FET is suitable for applications requiring robust power handling capabilities.

Maximum Power Dissipation (Abs): 83 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable performance.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this FET can operate in challenging environments without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal oxide semiconductor technology offers high input impedance and low power consumption, making this FET suitable for low power applications.

Technical Specifications

Power Field Effect Transistors (FET) FCMT360N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

40 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

10 A

Maximum Drain Current (ID):

10 A

Maximum Drain-Source On Resistance:

.36 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PSSO-N4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

25 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCMT360N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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