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FCMT080N65S3

Onsemi

FCMT080N65S3 by Onsemi

FCMT080N65S3 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 95A IDM, and 0.08 ohm RDS(on). Ideal for SWITCHING applications due to its 260W power dissipation, -55 to 150 °C operating temp range, and built-in DIODE.

Median Price

$4.808

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,397 parts In-Stock

1+ parts

$6.630

100+ parts

$3.269

1k+ parts

-

10k+ parts

$2.671

2,397

$6.630

$3.269

-

$2.671

Chip1Stop

Japan . 2,750 parts In-Stock

1+ parts

$26.800

100+ parts

$11.100

1k+ parts

$7.620

10k+ parts

-

2,750

$26.800

$11.100

$7.620

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Rochester

USA . 10,576 parts In-Stock

1+ parts

-

100+ parts

$2.670

1k+ parts

$2.390

10k+ parts

$2.250

10,576

-

$2.670

$2.390

$2.250

Verical

USA . 7,976 parts In-Stock

1+ parts

-

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-

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$2.987

10k+ parts

$2.813

7,976

-

-

$2.987

$2.813

Distributors (In-Stock)

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Digiode

USA . 1,751 parts In-Stock

1+ parts

$2.822

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-

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1,751

$2.822

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Vyrian

USA . 1,583 parts In-Stock

1+ parts

$2.970

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1,583

$2.970

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Flip Electronics

USA . 50,000 parts In-Stock

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50,000

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Sensible Micro Corp

USA . 12,212 parts In-Stock

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12,212

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Distributors (Availability)

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Corphita

USA . 729 parts In-Stock

1+ parts

$2.673

100+ parts

-

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729

$2.673

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Corohmni

South Africa . 83 parts In-Stock

1+ parts

$2.970

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83

$2.970

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Microchip USA

USA . 461 parts In-Stock

1+ parts

$29.444

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461

$29.444

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Perfect Parts

USA . 12,746 parts In-Stock

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12,746

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Kulean Microsystems

USA . 6,403 parts In-Stock

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SupplyDigital Components

Austria . 6,047 parts In-Stock

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6,047

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TANS Electronics

Latvia . 3,676 parts In-Stock

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3,676

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GreenTree Electronics

Israel . 2,870 parts In-Stock

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2,870

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A-Z Elektronik GmbH

Germany . 2,687 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,791 parts In-Stock

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Problanco Electronics

Mexico . 908 parts In-Stock

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908

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Native Components

USA . 609 parts In-Stock

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609

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Northwest PG Solutions

USA . 544 parts In-Stock

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544

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UHIMA Technologies

Türkiye . 30 parts In-Stock

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Overview

Experience the power and reliability of the FCMT080N65S3 by Onsemi, a top-of-the-line Power Field Effect Transistor with N-CHANNEL configuration. Designed for switching applications, this transistor offers unparalleled performance with a built-in diode, enhancing its capabilities. With a high breakdown voltage of 650V and maximum drain current of 38A, this product ensures efficiency and durability. Whether you're in the automotive, industrial, or consumer electronics industry, the FCMT080N65S3 provides exceptional value and benefits, making it the ideal choice for your projects. Trust in Onsemi's expertise and elevate your designs with this cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle higher voltage applications without the risk of damage.

Maximum Drain Current (ID): 38 A

The high maximum drain current allows this FET to handle large amounts of current, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 180 mJ

The high avalanche energy rating means this FET is less likely to fail under high voltage transients, ensuring reliability.

Maximum Power Dissipation (Abs): 260 W

This FET can dissipate up to 260 watts of power, making it suitable for high-power applications where heat dissipation is important.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in environments with elevated temperatures without overheating.

Technical Specifications

Power Field Effect Transistors (FET) FCMT080N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

38 A

Maximum Drain Current (ID):

38 A

Maximum Drain-Source On Resistance:

.08 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PSSO-N4

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

95 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCMT080N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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