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FCMT250N65S3

Onsemi

FCMT250N65S3 by Onsemi

FCMT250N65S3 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage, 30A IDM, and 0.25 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max power dissipation of 90W.

Median Price

$2.284

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,082 parts In-Stock

1+ parts

$1.791

100+ parts

-

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2,082

$1.791

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Chip1Stop

Japan . 3,000 parts In-Stock

1+ parts

$2.429

100+ parts

$1.942

1k+ parts

$1.853

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-

3,000

$2.429

$1.942

$1.853

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Mouser Electronics

USA . 1,071 parts In-Stock

1+ parts

$3.390

100+ parts

$2.190

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-

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1,071

$3.390

$2.190

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DigiKey

USA . 5,950 parts In-Stock

1+ parts

$5.170

100+ parts

$2.453

1k+ parts

$2.342

10k+ parts

$1.914

5,950

$5.170

$2.453

$2.342

$1.914

Rochester

USA . 26,152 parts In-Stock

1+ parts

-

100+ parts

$1.910

1k+ parts

$1.710

10k+ parts

$1.610

26,152

-

$1.910

$1.710

$1.610

Verical

USA . 13,170 parts In-Stock

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-

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$2.138

10k+ parts

$2.013

13,170

-

-

$2.138

$2.013

Distributors (In-Stock)

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Digiode

USA . 1,493 parts In-Stock

1+ parts

$2.024

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-

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1,493

$2.024

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Vyrian

USA . 1,237 parts In-Stock

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$2.130

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1,237

$2.130

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Flip Electronics

USA . 22,339 parts In-Stock

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22,339

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Corphita

USA . 1,708 parts In-Stock

1+ parts

$1.917

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-

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$1.917

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Continental Prestige Electronics

USA . 2 parts In-Stock

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$1.990

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2

$1.990

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Corohmni

South Africa . 272 parts In-Stock

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$2.130

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272

$2.130

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Microchip USA

USA . 5,363 parts In-Stock

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$14.029

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5,363

$14.029

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Perfect Parts

USA . 17,046 parts In-Stock

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SupplyDigital Components

Austria . 6,382 parts In-Stock

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TANS Electronics

Latvia . 5,950 parts In-Stock

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Kulean Microsystems

USA . 4,125 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,690 parts In-Stock

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GreenTree Electronics

Israel . 2,440 parts In-Stock

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Authorized Procurement Solutions

USA . 2,340 parts In-Stock

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2,340

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Alle Elektronik GmbH

Germany . 1,793 parts In-Stock

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Northwest PG Solutions

USA . 1,195 parts In-Stock

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UHIMA Technologies

Türkiye . 887 parts In-Stock

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Problanco Electronics

Mexico . 861 parts In-Stock

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Native Components

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Overview

Unlock the power of reliable performance with the FCMT250N65S3 by Onsemi. As a leading manufacturer in the industry, Onsemi brings unparalleled quality to their Power Field Effect Transistors. Ideal for switching applications, this N-Channel transistor offers a seamless experience with its built-in diode and enhancement mode operation. With a maximum breakdown voltage of 650V and a pulsing drain current of 30A, this transistor delivers exceptional efficiency and durability. Elevate your projects with the FCMT250N65S3 and experience the benefits of superior technology and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging makes the transistor lightweight and durable, ideal for applications where weight and reliability are key factors.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making them a good choice for high-power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode allows for better protection and efficiency in certain circuit configurations, making this FET versatile and convenient to use.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast response times and efficient power handling, making it suitable for a wide range of electronic devices.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and require less power to operate, making them ideal for applications where efficient power management is important.

Maximum Pulsed Drain Current (IDM): 30 A

The high pulsed drain current rating allows this FET to handle sudden spikes in current without being damaged, ensuring reliable performance in dynamic conditions.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating, this FET can handle large amounts of power without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature tolerance ensures stable performance even in environments with elevated temperatures, making this FET reliable in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) FCMT250N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.25 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PSSO-N4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCMT250N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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