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FCB260N65S3

Onsemi

FCB260N65S3 by Onsemi

FCB260N65S3 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has a max IDM of 30A and 0.26 ohm RDS(ON). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 90W power dissipation and -55 to 150°C temperature range.

Median Price

$1.675

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 6,441 parts In-Stock

1+ parts

$4.320

100+ parts

$2.010

1k+ parts

$1.740

10k+ parts

-

6,441

$4.320

$2.010

$1.740

-

DigiKey

USA . 1,110 parts In-Stock

1+ parts

$4.320

100+ parts

$2.009

1k+ parts

$1.573

10k+ parts

$1.502

1,110

$4.320

$2.009

$1.573

$1.502

Rochester

USA . 5,796 parts In-Stock

1+ parts

-

100+ parts

$1.580

1k+ parts

$1.410

10k+ parts

$1.330

5,796

-

$1.580

$1.410

$1.330

Verical

USA . 5,796 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.675

10k+ parts

$1.575

5,796

-

-

$1.675

$1.575

Arrow

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.569

10k+ parts

$1.526

800

-

-

$1.569

$1.526

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 689 parts In-Stock

1+ parts

$1.586

100+ parts

-

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689

$1.586

-

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Vyrian

USA . 1,916 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

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10k+ parts

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1,916

$1.670

-

-

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TME

Poland . 767 parts In-Stock

1+ parts

$4.060

100+ parts

$2.070

1k+ parts

$1.980

10k+ parts

-

767

$4.060

$2.070

$1.980

-

Chip Stock

USA . 4,700 parts In-Stock

1+ parts

-

100+ parts

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4,700

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Flip Electronics

USA . 800 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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800

-

-

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NAC Semi

USA . 800 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.200

10k+ parts

-

800

-

-

$3.200

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,312 parts In-Stock

1+ parts

$1.503

100+ parts

-

1k+ parts

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10k+ parts

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2,312

$1.503

-

-

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Corohmni

South Africa . 300 parts In-Stock

1+ parts

$1.670

100+ parts

-

1k+ parts

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10k+ parts

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300

$1.670

-

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Microchip USA

USA . 8,961 parts In-Stock

1+ parts

$13.741

100+ parts

-

1k+ parts

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8,961

$13.741

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Perfect Parts

USA . 73,366 parts In-Stock

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73,366

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Lixinc

USA . 10,960 parts In-Stock

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10,960

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Problanco Electronics

Mexico . 6,755 parts In-Stock

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6,755

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SupplyDigital Components

Austria . 6,533 parts In-Stock

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6,533

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A-Z Elektronik GmbH

Germany . 6,125 parts In-Stock

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6,125

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TANS Electronics

Latvia . 4,256 parts In-Stock

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4,256

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Kulean Microsystems

USA . 4,227 parts In-Stock

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4,227

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Alle Elektronik GmbH

Germany . 4,083 parts In-Stock

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4,083

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Northwest PG Solutions

USA . 2,207 parts In-Stock

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2,207

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Futuretech Components

Singapore . 2,091 parts In-Stock

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2,091

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Native Components

USA . 436 parts In-Stock

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436

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UHIMA Technologies

Türkiye . 309 parts In-Stock

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309

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Overview

Unlock the power of efficiency and reliability with the FCB260N65S3 by Onsemi. This Power Field Effect Transistor offers unparalleled quality and performance, making it the ideal choice for switching applications. With a maximum operating temperature of 150°C and a minimum breakdown voltage of 650V, this N-CHANNEL transistor ensures durability and stability in any environment. Experience seamless functionality and superior power management with the FCB260N65S3, a product that delivers exceptional value and benefits to every customer.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL design allows for efficient current flow and better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and protects against voltage spikes, making this product more versatile and reliable.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring optimal performance and efficiency in such scenarios.

Surface Mount: YES

Surface mount technology makes installation easier and saves space on the PCB, ideal for compact electronic devices.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage ensures reliable operation and protection against voltage surges, making this product suitable for high-power applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easier integration into existing circuit layouts, optimizing space and efficiency.

Terminal Form: GULL WING

Gull wing terminals provide better solderability and mechanical strength, contributing to the overall reliability of the product.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor's conductivity, making it suitable for various applications.

Maximum Pulsed Drain Current (IDM): 30 A

High pulsed drain current rating enables the transistor to handle sudden current spikes effectively, improving reliability in dynamic operating conditions.

Avalanche Energy Rating (EAS): 57 mJ

High avalanche energy rating indicates the transistor's capability to withstand high-energy pulses, making it suitable for rugged environments.

Maximum Drain Current (Abs) (ID): 12 A

High maximum drain current rating allows for reliable operation under continuous load, ensuring stable performance in various applications.

Maximum Power Dissipation (Abs): 90 W

High power dissipation rating indicates the transistor's ability to handle high power levels without overheating, ensuring long-term reliability.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it ideal for compact electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor energy-efficient and reliable.

Maximum Operating Temperature: 150 °C

High maximum operating temperature allows for reliable operation in various environmental conditions, ensuring performance consistency.

Transistor Element Material: SILICON

Silicon material provides excellent electrical properties and reliability, ensuring stable performance over the product's lifespan.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature range allows for operation in harsh environments, making this product suitable for a wide range of applications.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish offers good solderability and corrosion resistance, ensuring long-term reliability in various operating conditions.

Maximum Drain Current (ID): 12 A

High maximum drain current rating allows for reliable operation under continuous load, ensuring stable performance in various applications.

Maximum Drain-Source On Resistance: 0.26 ohm

Low drain-source on resistance minimizes power loss and heat generation, improving efficiency and performance of the product.

Terminal Position: SINGLE

Single terminal position simplifies installation and ensures proper connection, enhancing the overall reliability of the product.

Case Connection: DRAIN

Drain case connection provides efficient heat dissipation and electrical grounding, ensuring reliable operation under high-power conditions.

Maximum Time At Peak Reflow Temperature (s): 30

Short reflow time minimizes the risk of thermal damage during soldering, ensuring the product's reliability and longevity.

Peak Reflow Temperature °C: 245

High peak reflow temperature tolerance ensures proper soldering and rework capabilities, enhancing the overall reliability of the product.

Technical Specifications

Power Field Effect Transistors (FET) FCB260N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB260N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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