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FCB20N60

Onsemi

FCB20N60 by Onsemi

FCB20N60 by Onsemi is a N-CHANNEL FET with 600V DS Breakdown Voltage, 20A ID, and 0.19 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with 60A IDM and 690mJ EAS. Package style is SMALL OUTLINE with GULL WING terminals.

Median Price

$4.020

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 1,245 parts In-Stock

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$4.020

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$4.020

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Newark

USA . 1,085 parts In-Stock

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$6.430

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$4.090

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$6.430

$4.090

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Farnell

UK . 1,085 parts In-Stock

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$2.690

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$2.640

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1,085

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$2.690

$2.640

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Distributors (In-Stock)

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Digiode

USA . 1,214 parts In-Stock

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$4.674

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$4.674

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Vyrian

USA . 348 parts In-Stock

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$4.920

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348

$4.920

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Bristol Electronics

USA . 80 parts In-Stock

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$2.158

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80

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$2.158

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Dan-Mar Components

USA . 80 parts In-Stock

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80

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Prism Electronics

USA . 41 parts In-Stock

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ComSIT Distribution GmbH

Germany . 19 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,619 parts In-Stock

1+ parts

$4.428

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2,619

$4.428

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Corohmni

South Africa . 328 parts In-Stock

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$4.920

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328

$4.920

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Native Components

USA . 330 parts In-Stock

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$5.335

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330

$5.335

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Component Stockers USA

USA . 2,950 parts In-Stock

1+ parts

$5.400

100+ parts

$4.170

1k+ parts

$4.970

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2,950

$5.400

$4.170

$4.970

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Problanco Electronics

Mexico . 6,672 parts In-Stock

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TANS Electronics

Latvia . 6,183 parts In-Stock

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Authorized Procurement Solutions

USA . 5,500 parts In-Stock

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SupplyDigital Components

Austria . 5,138 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,063 parts In-Stock

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RC Electronics

USA . 4,860 parts In-Stock

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4,860

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Kulean Microsystems

USA . 3,825 parts In-Stock

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3,825

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Alle Elektronik GmbH

Germany . 3,375 parts In-Stock

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UHIMA Technologies

Türkiye . 860 parts In-Stock

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860

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Northwest PG Solutions

USA . 276 parts In-Stock

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$5.228

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276

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Continental Prestige Electronics

USA . 113 parts In-Stock

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$3.410

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$2.850

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113

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$3.410

$2.850

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Supply Digital

USA . 103 parts In-Stock

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Overview

Unlock the power of innovation with the FCB20N60 by Onsemi. As a leading manufacturer in the field of Power Field Effect Transistors, Onsemi delivers top-quality products that meet the highest standards. The FCB20N60 is a versatile N-CHANNEL transistor designed for SWITCHING applications, offering a high DS Breakdown Voltage of 600V and a maximum Drain Current of 20A. With its robust design and reliable performance, this transistor provides customers with a cost-effective solution for their electronic needs. Experience the efficiency and reliability of Onsemi's FCB20N60 and take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the Power FET.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of the flow of current.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the transistor package.

Transistor Application: SWITCHING

Designed specifically for high-speed switching applications, ensuring fast response times.

Surface Mount: YES

Enables easy and secure mounting on circuit boards for streamlined manufacturing processes.

Minimum DS Breakdown Voltage: 600 V

Provides high voltage tolerance, making it suitable for handling high-power applications.

Package Shape: RECTANGULAR

Facilitates efficient packing in circuit layouts and ensures compatibility with standard mounting techniques.

Terminal Form: GULL WING

Offers reliable electrical connections and easy soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Allows for enhanced control over the flow of current, making it ideal for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 60 A

Capable of handling high current surges for robust performance in demanding conditions.

Avalanche Energy Rating (EAS): 690 mJ

Offers protection against voltage spikes and transients, improving the reliability of the circuit.

No. of Terminals: 2

Simplifies circuit connections and reduces complexity in circuit design.

Package Style (Meter): SMALL OUTLINE

Compact design saves space and allows for high-density mounting on PCBs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides high efficiency and low power consumption for improved performance.

Maximum Operating Temperature: 150 °C

Suitable for a wide range of operating environments and ensures stable performance under varying conditions.

Transistor Element Material: SILICON

Known for its reliability and consistent performance, making it a durable choice for various applications.

Minimum Operating Temperature: -55 °C

Capable of operating in low-temperature environments without compromising performance.

Terminal Finish: MATTE TIN

Provides corrosion resistance and ensures a reliable electrical connection over time.

Maximum Drain Current (ID): 20 A

Can handle high current loads while maintaining efficient operation.

Maximum Drain-Source On Resistance: 0.19 ohm

Low on-resistance minimizes power loss and improves overall efficiency.

Terminal Position: SINGLE

Simplifies installation and connection of the transistor in the circuit.

Case Connection: DRAIN

Enables efficient heat dissipation from the transistor, ensuring optimal performance and reliability.

Technical Specifications

Power Field Effect Transistors (FET) FCB20N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

690 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB20N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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