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FCB20N60F-F085

Onsemi

FCB20N60F-F085 by Onsemi

FCB20N60F-F085 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, 20A ID, and 0.195 ohm RDS. Ideal for SWITCHING applications in automotive (AEC-Q101) and industrial sectors due to its high power dissipation of 405W and small outline package style.

Median Price

$3.470

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 800 parts In-Stock

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Rochester

USA . 640 parts In-Stock

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$3.470

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$3.100

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$2.920

640

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$3.470

$3.100

$2.920

DigiKey

USA . 640 parts In-Stock

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$4.020

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640

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$4.020

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Mouser Electronics

USA . 301 parts In-Stock

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$2.940

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$2.660

301

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$2.660

Distributors (In-Stock)

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Vyrian

USA . 1,394 parts In-Stock

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$2.940

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Digiode

USA . 3,099 parts In-Stock

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$3.676

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$3.676

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Flip Electronics

USA . 800 parts In-Stock

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800

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$1.300

100+ parts

$1.183

1k+ parts

$1.066

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270

$1.300

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$1.066

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Native Components

USA . 153 parts In-Stock

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$1.970

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Northwest PG Solutions

USA . 1,552 parts In-Stock

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$2.167

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Corohmni

South Africa . 128 parts In-Stock

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$3.450

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$3.450

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Corphita

USA . 3,011 parts In-Stock

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$3.483

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Microchip USA

USA . 167 parts In-Stock

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$29.510

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 29,353 parts In-Stock

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Kepictronics

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GreenTree Electronics

Israel . 8,000 parts In-Stock

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Problanco Electronics

Mexico . 6,290 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Authorized Procurement Solutions

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Perfect Parts

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TANS Electronics

Latvia . 1,493 parts In-Stock

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Continental Prestige Electronics

USA . 640 parts In-Stock

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$2.790

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Kulean Microsystems

USA . 517 parts In-Stock

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UHIMA Technologies

Türkiye . 312 parts In-Stock

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Supply Digital

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SupplyDigital Components

Austria . 134 parts In-Stock

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Overview

Upgrade your power management system with the FCB20N60F-F085 by Onsemi. Manufactured with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor offers enhanced switching capabilities for a variety of applications. With a maximum drain current of 20A and a minimum breakdown voltage of 600V, this transistor ensures optimal performance under high power conditions. Experience the benefits of efficiency and durability that Onsemi products are known for, and elevate your projects to new heights with the FCB20N60F-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation properties and mechanical strength, making the FET durable and reliable for various applications.

Minimum DS Breakdown Voltage: 600 V

Allows the FET to handle higher voltages, making it suitable for switching applications in industrial and automotive settings.

Maximum Drain Current (Abs) (ID): 20 A

Capable of handling high current loads, making it ideal for power switching applications.

Maximum Power Dissipation (Abs): 405 W

Can dissipate heat efficiently at high power levels, ensuring stable and reliable performance under demanding conditions.

Maximum Operating Temperature: 150 °C

Can operate effectively at elevated temperatures, suitable for use in environments where heat is a concern.

Avalanche Energy Rating (EAS): 217.8 mJ

Provides protection against voltage spikes and transient events, enhancing the FET's reliability in power switching applications.

Reference Standard: AEC-Q101

Compliance with automotive quality standard ensures that the FET meets the stringent requirements for automotive applications, ensuring high reliability and performance.

Technical Specifications

Power Field Effect Transistors (FET) FCB20N60F-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

217.8 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.195 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB20N60F-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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