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FCB20N60-F085

Onsemi

FCB20N60-F085 by Onsemi

FCB20N60-F085 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, 20A ID, and 0.198 ohm RDS. Ideal for SWITCHING applications in ENHANCEMENT MODE, it has a 341W power dissipation rating and operates up to 150 °C.

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3

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1k+

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Vyrian

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Digiode

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J2 Sourcing AB

Sweden . 6 parts In-Stock

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Native Components

USA . 167 parts In-Stock

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Northwest PG Solutions

USA . 391 parts In-Stock

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$2.167

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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A-Z Elektronik GmbH

Germany . 10,989 parts In-Stock

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Microchip USA

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Kulean Microsystems

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Problanco Electronics

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Authorized Procurement Solutions

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TANS Electronics

Latvia . 3,876 parts In-Stock

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Alle Elektronik GmbH

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SupplyDigital Components

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Corphita

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UHIMA Technologies

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Corohmni

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Overview

Experience the power and reliability of the FCB20N60-F085 by Onsemi, a leading manufacturer in the industry. This N-channel Power Field Effect Transistor (FET) with a built-in diode is perfect for switching applications. Enjoy the benefits of its high breakdown voltage, low on-resistance, and enhanced mode operation. With a maximum drain current of 20A and a peak power dissipation of 341W, this transistor delivers exceptional performance and durability. Trust Onsemi for quality components that meet your needs for efficiency and precision. Elevate your projects with the FCB20N60-F085 and experience the difference.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the FET, making it durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher current-carrying capacity, making them suitable for high-power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient and fast switching operations, reducing losses and improving performance.

Transistor Application: SWITCHING

Ideal for switching applications due to its fast response time and high current rating.

Surface Mount: YES

Easily mountable on PCBs, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 600 V

Suitable for high voltage applications, providing reliability and safety.

Terminal Form: GULL WING

Gull wing terminals are suitable for automated pick-and-place assembly processes, improving manufacturing efficiency.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer better control and lower conduction losses compared to depletion mode FETs.

Avalanche Energy Rating (EAS): 480 mJ

Good avalanche energy rating ensures reliable operation in high-energy transient conditions.

Maximum Drain Current (Abs) (ID): 20 A

High drain current rating allows for use in high-power applications without the risk of overheating.

Maximum Power Dissipation (Abs): 341 W

High power dissipation capability enables the FET to handle high current and voltage loads efficiently.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and performance in electronic devices.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, the FET can be used in various applications without the risk of overheating.

Maximum Drain-Source On Resistance: 0.198 ohm

Low ON-resistance minimizes power losses and improves efficiency in switching applications.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and reduces assembly complexity.

Case Connection: DRAIN

Drain connection provides better heat dissipation and easier connection to other components in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) FCB20N60-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

480 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

20 A

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.198 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB20N60-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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