Loading...

EFC3C001NUZTCG

Onsemi

EFC3C001NUZTCG by Onsemi

EFC3C001NUZTCG by Onsemi is a N-CHANNEL FET with COMMON DRAIN configuration, built-in diode and resistor. Ideal for SWITCHING applications, it operates in DEPLETION MODE with 2 elements, 4 terminals, and max power dissipation of 1.6W at 150 °C. Suitable for surface mount with PLASTIC/EPOXY body material in SQUARE shape chip carrier package.

Median Price

$0.115

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 9,820 parts In-Stock

1+ parts

-

100+ parts

$0.119

1k+ parts

$0.099

10k+ parts

$0.088

9,820

-

$0.119

$0.099

$0.088

DigiKey

USA . 9,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.110

9,820

-

-

-

$0.110

Verical

USA . 9,820 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.115

9,820

-

-

-

$0.115

Flip Electronics (Authorized)

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 734 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

-

734

$0.089

-

-

-

Digiode

USA . 2,213 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213

$0.097

-

-

-

Flip Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 140 parts In-Stock

1+ parts

$0.089

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$0.089

-

-

-

Corphita

USA . 1,710 parts In-Stock

1+ parts

$0.092

100+ parts

-

1k+ parts

-

10k+ parts

-

1,710

$0.092

-

-

-

Native Components

USA . 29 parts In-Stock

1+ parts

$80.526

100+ parts

-

1k+ parts

-

10k+ parts

$77.305

29

$80.526

-

-

$77.305

Northwest PG Solutions

USA . 1,386 parts In-Stock

1+ parts

$88.579

100+ parts

-

1k+ parts

-

10k+ parts

-

1,386

$88.579

-

-

-

Kulean Microsystems

USA . 7,251 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,251

-

-

-

-

Continental Prestige Electronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.089

10k+ parts

-

5,000

-

-

$0.089

-

Kepictronics

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

SupplyDigital Components

Austria . 2,433 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,433

-

-

-

-

Problanco Electronics

Mexico . 1,284 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,284

-

-

-

-

UHIMA Technologies

Türkiye . 628 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

628

-

-

-

-

TANS Electronics

Latvia . 563 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

563

-

-

-

-

Overview

Discover the EFC3C001NUZTCG by Onsemi, a high-quality Power FET with N-CHANNEL polarity and COMMON DRAIN configuration. Perfect for switching applications, this transistor offers convenience with its 2 elements, built-in diode and resistor, all in a compact square package. With efficient surface mount technology and a maximum power dissipation of 1.6W, this product provides value and reliability to customers looking for top-notch performance in their electronic devices. Elevate your projects with the trusted manufacturer Onsemi, and experience the benefits of the EFC3C001NUZTCG today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and resistance to external factors, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making this product suitable for high-performance tasks.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor provide additional functionality and simplify circuit design, making it a versatile option for different applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast and efficient performance in turning on and off circuits, making it ideal for power control applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving space and facilitating automated manufacturing processes.

Maximum Power Dissipation (Abs): 1.6 W

With a high maximum power dissipation, this FET can handle demanding tasks without overheating, ensuring reliability under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds and low power consumption, making this FET energy-efficient and suitable for modern electronics.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without performance degradation, ensuring stability in various environments.

Technical Specifications

Power Field Effect Transistors (FET) EFC3C001NUZTCG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PBCC-N4

No. of Elements:

2

No. of Terminals:

4

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC3C001NUZTCG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 2