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EFC3J023NUZTDG

Onsemi

EFC3J023NUZTDG by Onsemi

EFC3J023NUZTDG by Onsemi is a N-CHANNEL FET with 2 elements, diode, and resistor. It operates in DEPLETION MODE for SWITCHING applications. With a max power dissipation of 2.7W and operating temperature up to 150 °C, it is ideal for high-power electronic devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,742 parts In-Stock

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Digiode

USA . 850 parts In-Stock

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850

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TANS Electronics

Latvia . 6,684 parts In-Stock

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6,684

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SupplyDigital Components

Austria . 5,545 parts In-Stock

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Kulean Microsystems

USA . 3,200 parts In-Stock

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3,200

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Corphita

USA . 1,492 parts In-Stock

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Problanco Electronics

Mexico . 1,202 parts In-Stock

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Northwest PG Solutions

USA . 940 parts In-Stock

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940

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Native Components

USA . 251 parts In-Stock

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$4.278

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UHIMA Technologies

Türkiye . 167 parts In-Stock

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Corohmni

South Africa . 149 parts In-Stock

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Overview

Discover the power and reliability of the EFC3J023NUZTDG by Onsemi, a top-tier manufacturer known for producing high-quality Power Field Effect Transistors (FET). This N-CHANNEL transistor offers exceptional performance in switching applications, with a common drain configuration and built-in diode and resistor for added convenience. Ideal for a wide range of electronic projects, this surface mount chip carrier is designed to enhance efficiency and maximize power dissipation. Trust in Onsemi's expertise and choose the EFC3J023NUZTDG for superior results in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-CHANNEL configuration allows for efficient switching and control of current flow in a circuit.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Common drain configuration with built-in diode and resistor provides added functionality and ease of implementation in circuits.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability allows for easy installation and integration in modern electronic devices.

Package Shape: RECTANGULAR

Rectangular package shape offers efficient use of space and easy alignment in circuit design.

Operating Mode: DEPLETION MODE

Depletion mode operation can be beneficial in certain circuit designs and applications where this mode is preferred.

Maximum Power Dissipation (Abs): 2.7 W

With a maximum power dissipation of 2.7 W, this FET can handle moderate power levels effectively.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides compactness and efficient heat dissipation for the FET.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology ensures high performance and reliability in the FET.

Maximum Operating Temperature: 150 °C

Capable of operating at temperatures up to 150 °C, making it suitable for a wide range of environments.

Transistor Element Material: SILICON

Silicon-based transistor element offers good conductivity and performance in the FET.

Terminal Position: BOTTOM

Bottom terminal position provides ease of connection and integration in circuit layouts.

Case Connection: SOURCE

Source case connection ensures proper grounding and current flow in the FET.

Technical Specifications

Power Field Effect Transistors (FET) EFC3J023NUZTDG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N10

No. of Elements:

2

No. of Terminals:

10

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC3J023NUZTDG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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