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EFC2J013NUZTDG

Onsemi

EFC2J013NUZTDG by Onsemi

EFC2J013NUZTDG by Onsemi is a N-CHANNEL FET with COMMON DRAIN configuration. It features 2 elements, built-in diode and resistor for SWITCHING applications. Operating in DEPLETION MODE, it has a max power dissipation of 1.8W at 150°C, making it suitable for high-power electronic devices.

Median Price

$0.500

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,362 parts In-Stock

1+ parts

$0.500

100+ parts

$0.274

1k+ parts

$0.232

10k+ parts

$0.211

3,362

$0.500

$0.274

$0.232

$0.211

Mouser Electronics

USA . 644 parts In-Stock

1+ parts

$0.500

100+ parts

$0.254

1k+ parts

$0.233

10k+ parts

$0.222

644

$0.500

$0.254

$0.233

$0.222

Chip1Stop

Japan . 5,887 parts In-Stock

1+ parts

$2.470

100+ parts

$0.692

1k+ parts

$0.466

10k+ parts

-

5,887

$2.470

$0.692

$0.466

-

Verical

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.193

40,000

-

-

-

$0.193

Rochester

USA . 1,645 parts In-Stock

1+ parts

-

100+ parts

$0.260

1k+ parts

$0.216

10k+ parts

$0.193

1,645

-

$0.260

$0.216

$0.193

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 175 parts In-Stock

1+ parts

$0.202

100+ parts

-

1k+ parts

-

10k+ parts

-

175

$0.202

-

-

-

Vyrian

USA . 726 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

726

$0.206

-

-

-

Flip Electronics

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

NAC Semi

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.518

10,000

-

-

-

$0.518

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 994 parts In-Stock

1+ parts

$0.192

100+ parts

-

1k+ parts

-

10k+ parts

-

994

$0.192

-

-

-

Corohmni

South Africa . 80 parts In-Stock

1+ parts

$0.206

100+ parts

-

1k+ parts

-

10k+ parts

-

80

$0.206

-

-

-

Kepictronics

USA . 603,195 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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603,195

-

-

-

-

RC Electronics

USA . 200,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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200,000

-

-

-

-

Perfect Parts

USA . 69,154 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

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69,154

-

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 9,872 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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9,872

-

-

-

-

Problanco Electronics

Mexico . 7,749 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,749

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,666 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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6,666

-

-

-

-

GreenTree Electronics

Israel . 5,987 parts In-Stock

1+ parts

-

100+ parts

-

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-

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5,987

-

-

-

-

Metaverse IC Inc.

Canada . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Continental Prestige Electronics

USA . 4,909 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.260

10k+ parts

-

4,909

-

-

$0.260

-

Alle Elektronik GmbH

Germany . 4,444 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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4,444

-

-

-

-

Kulean Microsystems

USA . 2,490 parts In-Stock

1+ parts

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100+ parts

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2,490

-

-

-

-

Northwest PG Solutions

USA . 1,896 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

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1,896

-

-

-

-

TANS Electronics

Latvia . 1,823 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,823

-

-

-

-

SupplyDigital Components

Austria . 754 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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754

-

-

-

-

Native Components

USA . 643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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643

-

-

-

-

UHIMA Technologies

Türkiye . 107 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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107

-

-

-

-

Overview

Experience the power of innovation with the EFC2J013NUZTDG by Onsemi. As a leading manufacturer in the industry, Onsemi brings you top-quality Power Field Effect Transistors that are perfect for a wide range of applications. With its advanced features and design, this N-CHANNEL FET offers unmatched reliability and performance. Whether you're looking for a high-efficiency switch or a dependable semiconductor solution, this product has got you covered. Say goodbye to compromises and hello to excellence with the EFC2J013NUZTDG – your ultimate choice for power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good durability and protection for the FET, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The common drain configuration with built-in diode and resistor allows for simplified circuit design and can help save space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and high efficiency.

Surface Mount: YES

With surface mount capability, this FET is easy to integrate into modern PCB designs and manufacturing processes.

Package Shape: RECTANGULAR

The rectangular package shape provides a standardized form factor for easy integration and mounting on the PCB.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this FET can withstand demanding operating conditions without sacrificing performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology used in this FET offers high performance and reliability for switching applications.

Transistor Element Material: SILICON

Silicon is a common and reliable material for transistor elements, ensuring consistent performance and durability.

Technical Specifications

Power Field Effect Transistors (FET) EFC2J013NUZTDG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N6

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC2J013NUZTDG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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