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EFC2K103NUZTDG

Onsemi

EFC2K103NUZTDG by Onsemi

EFC2K103NUZTDG by Onsemi is an N-CHANNEL FET with COMMON DRAIN configuration, 2 elements, diode, and resistor. Ideal for SWITCHING applications, it operates in DEPLETION MODE with a max power dissipation of 3.3W at 150°C. This METAL-OXIDE SEMICONDUCTOR FET comes in a CHIP CARRIER package shape for surface mount assembly.

Median Price

$0.626

Lifecycle Status

EOL

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,877 parts In-Stock

1+ parts

$1.150

100+ parts

$0.732

1k+ parts

$0.505

10k+ parts

-

1,877

$1.150

$0.732

$0.505

-

Farnell

UK . 315,587 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

$0.414

315,587

-

-

-

$0.414

Rochester

USA . 210,016 parts In-Stock

1+ parts

-

100+ parts

$0.614

1k+ parts

$0.509

10k+ parts

$0.454

210,016

-

$0.614

$0.509

$0.454

Verical

USA . 210,016 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.637

10k+ parts

$0.568

210,016

-

-

$0.637

$0.568

Distributors (In-Stock)

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Vyrian

USA . 1,273 parts In-Stock

1+ parts

$0.414

100+ parts

-

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1,273

$0.414

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-

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Digiode

USA . 223 parts In-Stock

1+ parts

$0.478

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-

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223

$0.478

-

-

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Flip Electronics

USA . 15,000 parts In-Stock

1+ parts

-

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15,000

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ACDS - Activité Composants Distribution Service

France . 10,000 parts In-Stock

1+ parts

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Bristol Electronics

USA . 10,000 parts In-Stock

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10,000

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Dan-Mar Components

USA . 10,000 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 70 parts In-Stock

1+ parts

$0.414

100+ parts

-

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70

$0.414

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Corphita

USA . 1,751 parts In-Stock

1+ parts

$0.453

100+ parts

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1,751

$0.453

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Native Components

USA . 369 parts In-Stock

1+ parts

$68.167

100+ parts

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10k+ parts

$65.440

369

$68.167

-

-

$65.440

Northwest PG Solutions

USA . 104 parts In-Stock

1+ parts

$74.984

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104

$74.984

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Continental Prestige Electronics

USA . 316,107 parts In-Stock

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$0.414

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316,107

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$0.414

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Kepictronics

USA . 25,000 parts In-Stock

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25,000

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Problanco Electronics

Mexico . 6,344 parts In-Stock

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6,344

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SupplyDigital Components

Austria . 5,603 parts In-Stock

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5,603

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Kulean Microsystems

USA . 1,753 parts In-Stock

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1,753

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TANS Electronics

Latvia . 1,542 parts In-Stock

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1,542

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UHIMA Technologies

Türkiye . 337 parts In-Stock

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337

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Microchip USA

USA . 163 parts In-Stock

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163

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Overview

Discover the unparalleled performance and reliability of the EFC2K103NUZTDG by Onsemi, a leading manufacturer in the industry. This N-CHANNEL Power FET boasts a COMMON DRAIN configuration with 2 elements, a built-in diode, and resistor for seamless switching applications. With a maximum power dissipation of 3.3 W and operating temperature up to 150°C, this chip carrier package offers unmatched value and benefits to customers looking for high-quality components. Elevate your projects with the cutting-edge technology of Onsemi's EFC2K103NUZTDG.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better conductivity and lower on-resistance compared to P-channel FETs, making them a good choice for high-performance applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The common drain configuration allows for high input impedance and low output impedance, which can improve overall efficiency and performance. The built-in diode and resistor offer added functionality and protection.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can quickly turn on and off, making it ideal for tasks that require fast switching speeds and high efficiency.

Surface Mount: YES

Being surface mount compatible makes installation easier and more convenient, especially in compact or densely populated circuit boards.

Maximum Power Dissipation (Abs): 3.3 W

With a high maximum power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation even under demanding conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Using MOS technology provides high switching speeds, low gate capacitance, and improved efficiency, making it a preferred choice for modern electronic devices.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows for operation in harsh environments, ensuring the FET remains stable and reliable even when exposed to elevated temperatures.

Technical Specifications

Power Field Effect Transistors (FET) EFC2K103NUZTDG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N10

No. of Elements:

2

No. of Terminals:

10

Operating Mode:

DEPLETION MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC2K103NUZTDG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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