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EFC2K102NUZTDG

Onsemi

EFC2K102NUZTDG by Onsemi

EFC2K102NUZTDG by Onsemi is an N-CHANNEL FET with COMMON DRAIN configuration. It features 2 elements, built-in diode and resistor, for SWITCHING applications. With a max power dissipation of 3.1W and operating temperature of 150 °C, it is ideal for high-performance electronic devices.

Median Price

$0.490

Lifecycle Status

EOL

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 4,645 parts In-Stock

1+ parts

$1.390

100+ parts

$0.584

1k+ parts

$0.416

10k+ parts

$0.382

4,645

$1.390

$0.584

$0.416

$0.382

Rochester

USA . 210,000 parts In-Stock

1+ parts

-

100+ parts

$0.473

1k+ parts

$0.392

10k+ parts

$0.350

210,000

-

$0.473

$0.392

$0.350

Verical

USA . 210,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.490

10k+ parts

$0.437

210,000

-

-

$0.490

$0.437

Flip Electronics (Authorized)

USA . 103,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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103,690

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 115 parts In-Stock

1+ parts

$0.369

100+ parts

-

1k+ parts

-

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115

$0.369

-

-

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Vyrian

USA . 2,471 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

-

2,471

$0.388

-

-

-

Flip Electronics

USA . 103,690 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

103,690

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,478 parts In-Stock

1+ parts

$0.349

100+ parts

-

1k+ parts

-

10k+ parts

-

2,478

$0.349

-

-

-

Corohmni

South Africa . 324 parts In-Stock

1+ parts

$0.388

100+ parts

-

1k+ parts

-

10k+ parts

-

324

$0.388

-

-

-

Native Components

USA . 989 parts In-Stock

1+ parts

$5.266

100+ parts

-

1k+ parts

-

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989

$5.266

-

-

-

Problanco Electronics

Mexico . 6,143 parts In-Stock

1+ parts

-

100+ parts

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6,143

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Kepictronics

USA . 5,380 parts In-Stock

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5,380

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TANS Electronics

Latvia . 5,265 parts In-Stock

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5,265

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SupplyDigital Components

Austria . 4,880 parts In-Stock

1+ parts

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4,880

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Kulean Microsystems

USA . 3,857 parts In-Stock

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3,857

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Northwest PG Solutions

USA . 1,939 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$5.161

10k+ parts

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1,939

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-

$5.161

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

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100+ parts

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1,000

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UHIMA Technologies

Türkiye . 384 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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384

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-

Overview

Upgrade your power systems with the EFC2K102NUZTDG from Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor. With its common drain configuration, built-in diode and resistor, and enhancement mode operation, this transistor is perfect for switching applications. Say goodbye to overheating issues as it boasts a maximum power dissipation of 3.1W and can operate at temperatures up to 150 °C. Trust in Onsemi's reputation for excellence and invest in this reliable and efficient component to enhance the performance of your electronic devices.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher electron mobility compared to P-channel FETs, making them more efficient for switching applications.

Configuration: COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

Common drain configuration provides high output impedance and low input impedance, making it suitable for buffering and voltage amplification applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast switching speeds and efficient power handling.

Maximum Power Dissipation (Abs): 3.1 W

With a high maximum power dissipation, this FET can handle higher power levels without overheating or failing prematurely.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance and reliability, making this FET suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) EFC2K102NUZTDG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

SOURCE

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XBCC-N10

No. of Elements:

2

No. of Terminals:

10

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

EFC2K102NUZTDG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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