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CPH5802

Onsemi

CPH5802 by Onsemi

CPH5802 by Onsemi is a P-CHANNEL FET with 20V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode and GULL WING terminals. Operating in enhancement mode, it has a max drain current of 2A and 0.145 ohm on-resistance at 125 °C.

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2

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1k+

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Vyrian

USA . 1,956 parts In-Stock

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Digiode

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Native Components

USA . 690 parts In-Stock

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$4.995

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TANS Electronics

Latvia . 3,857 parts In-Stock

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Problanco Electronics

Mexico . 2,476 parts In-Stock

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SupplyDigital Components

Austria . 2,459 parts In-Stock

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Kulean Microsystems

USA . 1,543 parts In-Stock

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Corphita

USA . 1,527 parts In-Stock

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Northwest PG Solutions

USA . 1,472 parts In-Stock

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UHIMA Technologies

Türkiye . 589 parts In-Stock

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Corohmni

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Overview

Upgrade your electronic devices with the high-quality CPH5802 P-channel Field Effect Transistor by Onsemi. Designed for switching applications, this small signal FET offers reliable performance and efficiency. With a built-in diode and a maximum drain current of 2A, this transistor is ideal for a wide range of electronic applications. Trust in Onsemi's reputation for producing top-notch components, and experience the value and benefits that the CPH5802 can bring to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, ensuring durability and reliability.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for low power consumption and high input impedance, making them suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, adding an extra layer of safety to the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and high efficiency.

Surface Mount: YES

Surface mount technology allows for easy and compact installation on PCBs, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without damage.

Maximum Drain Current (ID): 2 A

Capable of handling up to 2A of current, making it suitable for a wide range of low to medium power applications.

Maximum Power Dissipation (Abs): 0.9 W

With a maximum power dissipation of 0.9W, this transistor can safely handle heat dissipation, reducing the risk of overheating.

Maximum Operating Temperature: 125 °C

Capable of operating at temperatures up to 125 °C, making it suitable for high-temperature environments.

Maximum Drain-Source On Resistance: 0.145 ohm

Low drain-source on resistance minimizes power loss and improves efficiency in switching applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) CPH5802 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

.145 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G5

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

125 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

CPH5802 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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