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CAV24M01YE-GT3

Onsemi

CAV24M01YE-GT3 by Onsemi

CAV24M01YE-GT3 by Onsemi is an EEPROM with 128KX8 organization, operating at 5V. It features a serial interface, small outline package style, and automotive temperature grade. Ideal for applications requiring non-volatile memory storage in harsh environments.

Median Price

$1.470

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,670 parts In-Stock

1+ parts

$0.867

100+ parts

$0.815

1k+ parts

$0.737

10k+ parts

-

1,670

$0.867

$0.815

$0.737

-

Mouser Electronics

USA . 4,756 parts In-Stock

1+ parts

$1.470

100+ parts

$1.280

1k+ parts

-

10k+ parts

-

4,756

$1.470

$1.280

-

-

DigiKey

USA . 2,953 parts In-Stock

1+ parts

$1.470

100+ parts

$1.278

1k+ parts

$1.180

10k+ parts

-

2,953

$1.470

$1.278

$1.180

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 966 parts In-Stock

1+ parts

$0.824

100+ parts

-

1k+ parts

-

10k+ parts

-

966

$0.824

-

-

-

Chip Stock

USA . 57,000 parts In-Stock

1+ parts

-

100+ parts

-

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57,000

-

-

-

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Vyrian

USA . 132 parts In-Stock

1+ parts

-

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-

1k+ parts

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132

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-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 715 parts In-Stock

1+ parts

$0.237

100+ parts

-

1k+ parts

-

10k+ parts

$0.228

715

$0.237

-

-

$0.228

Northwest PG Solutions

USA . 1,985 parts In-Stock

1+ parts

$0.261

100+ parts

-

1k+ parts

-

10k+ parts

$0.230

1,985

$0.261

-

-

$0.230

Corphita

USA . 951 parts In-Stock

1+ parts

$0.780

100+ parts

-

1k+ parts

-

10k+ parts

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951

$0.780

-

-

-

Corohmni

South Africa . 162 parts In-Stock

1+ parts

$0.867

100+ parts

-

1k+ parts

-

10k+ parts

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162

$0.867

-

-

-

AZTECH Wire

Italy . 132 parts In-Stock

1+ parts

$16.540

100+ parts

-

1k+ parts

-

10k+ parts

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132

$16.540

-

-

-

Microchip USA

USA . 5,341 parts In-Stock

1+ parts

$22.375

100+ parts

-

1k+ parts

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10k+ parts

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5,341

$22.375

-

-

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QUARKTWIN TECHNOLOGY LTD

USA . 8,890 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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8,890

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-

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TANS Electronics

Latvia . 8,197 parts In-Stock

1+ parts

-

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8,197

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-

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SupplyDigital Components

Austria . 8,018 parts In-Stock

1+ parts

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100+ parts

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8,018

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-

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Kulean Microsystems

USA . 7,443 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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7,443

-

-

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Problanco Electronics

Mexico . 4,988 parts In-Stock

1+ parts

-

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4,988

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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1,000

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-

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UHIMA Technologies

Türkiye . 726 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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726

-

-

-

-

Overview

Unlock endless possibilities with the Onsemi CAV24M01YE-GT3 EEPROM. Crafted with precision and expertise by Onsemi, this high-quality memory chip is perfect for automotive applications, offering reliable storage solutions in a small package. Experience seamless operation with its synchronous mode and I2C serial bus type, ensuring efficient performance at all times. With a wide operating temperature range and durable nickel/palladium/gold terminal finish, this EEPROM guarantees longevity and reliability. Upgrade your automotive electronics with the Onsemi CAV24M01YE-GT3 and enjoy unparalleled value and performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the EEPROM, ensuring a longer lifespan.

Surface Mount: YES

Allows for easy installation on circuit boards, saving space and streamlining production processes.

Operating Mode: SYNCHRONOUS

Enables faster data transfer and communication between the EEPROM and the system it is connected to.

Nominal Supply Voltage / Vsup (V): 5

Compatible with standard voltage requirements, making it suitable for a wide range of applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments, making it suitable for automotive applications or industrial settings.

Memory IC Type: EEPROM

Specifically designed for non-volatile memory storage, ensuring data retention even when power is lost.

Technical Specifications

EEPROM CAV24M01YE-GT3 attributes and parameters. Explore more EEPROM devices from Onsemi

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.4 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1.2 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

CAV24M01YE-GT3 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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