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BDX33BG

Onsemi

BDX33BG by Onsemi

NPN; Configuration: DARLINGTON WITH BUILT-IN DIODE AND RESISTOR; Surface Mount: NO; Nominal Transition Frequency (fT): 3 MHz; Maximum Power Dissipation (Abs): 70 W; Maximum Collector Current (IC): 10 A;

Median Price

$1.008

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,474 parts In-Stock

1+ parts

$0.510

100+ parts

$0.500

1k+ parts

$0.490

10k+ parts

-

1,474

$0.510

$0.500

$0.490

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Farnell

UK . 1,476 parts In-Stock

1+ parts

$1.350

100+ parts

$0.563

1k+ parts

$0.376

10k+ parts

$0.371

1,476

$1.350

$0.563

$0.376

$0.371

Mouser Electronics

USA . 174 parts In-Stock

1+ parts

$1.570

100+ parts

$0.678

1k+ parts

$0.431

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174

$1.570

$0.678

$0.431

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DigiKey

USA . 95 parts In-Stock

1+ parts

$1.570

100+ parts

$0.664

1k+ parts

$0.476

10k+ parts

$0.377

95

$1.570

$0.664

$0.476

$0.377

Newark

USA . 1,426 parts In-Stock

1+ parts

$1.730

100+ parts

$0.836

1k+ parts

$0.595

10k+ parts

$0.589

1,426

$1.730

$0.836

$0.595

$0.589

Element14

Singapore . 1,476 parts In-Stock

1+ parts

$2.280

100+ parts

$0.947

1k+ parts

$0.624

10k+ parts

$0.612

1,476

$2.280

$0.947

$0.624

$0.612

Arrow

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$0.541

1k+ parts

$0.409

10k+ parts

$0.383

1,700

-

$0.541

$0.409

$0.383

Verical

USA . 1,700 parts In-Stock

1+ parts

-

100+ parts

$0.541

1k+ parts

$0.409

10k+ parts

$0.383

1,700

-

$0.541

$0.409

$0.383

Chip1Stop

Japan . 543 parts In-Stock

1+ parts

-

100+ parts

$0.667

1k+ parts

$0.471

10k+ parts

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543

-

$0.667

$0.471

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EBV Elektronik

Germany . 300 parts In-Stock

1+ parts

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300

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RS (Exports)

UK . 10 parts In-Stock

1+ parts

-

100+ parts

$0.547

1k+ parts

$0.387

10k+ parts

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10

-

$0.547

$0.387

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 673 parts In-Stock

1+ parts

$0.398

100+ parts

-

1k+ parts

-

10k+ parts

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673

$0.398

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Vyrian

USA . 4,742 parts In-Stock

1+ parts

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4,742

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VNN

France . 4,695 parts In-Stock

1+ parts

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4,695

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Flip Electronics

USA . 1,000 parts In-Stock

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1,000

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ComSIT Distribution GmbH

Germany . 600 parts In-Stock

1+ parts

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600

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ComSIT USA

USA . 600 parts In-Stock

1+ parts

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600

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LIBRA Elektronik GmbH

Germany . 435 parts In-Stock

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435

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NAC Semi

USA . 250 parts In-Stock

1+ parts

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100+ parts

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$1.930

10k+ parts

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250

-

-

$1.930

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IBS Electronics

USA . 150 parts In-Stock

1+ parts

-

100+ parts

$0.547

1k+ parts

$0.519

10k+ parts

$0.498

150

-

$0.547

$0.519

$0.498

Nova Conductors

Japan . 15 parts In-Stock

1+ parts

-

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 449 parts In-Stock

1+ parts

$0.377

100+ parts

-

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-

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449

$0.377

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Corohmni

South Africa . 478 parts In-Stock

1+ parts

$0.417

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478

$0.417

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Component Stockers USA

USA . 1,575 parts In-Stock

1+ parts

$0.970

100+ parts

$0.620

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1,575

$0.970

$0.620

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Continental Prestige Electronics

USA . 796 parts In-Stock

1+ parts

$1.000

100+ parts

$0.734

1k+ parts

$0.446

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796

$1.000

$0.734

$0.446

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Lixinc

USA . 11,663 parts In-Stock

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11,663

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TANS Electronics

Latvia . 7,700 parts In-Stock

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7,700

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Perfect Parts

USA . 7,199 parts In-Stock

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Kulean Microsystems

USA . 6,276 parts In-Stock

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6,276

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SupplyDigital Components

Austria . 5,228 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Argo Parts USA

USA . 2,277 parts In-Stock

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2,277

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Aranea Global

USA . 1,000 parts In-Stock

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1,000

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Problanco Electronics

Mexico . 957 parts In-Stock

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957

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UHIMA Technologies

Türkiye . 810 parts In-Stock

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810

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Eastek

USA . 400 parts In-Stock

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400

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GreenTree Electronics

Israel . 400 parts In-Stock

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400

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Technical Specifications

Power Bipolar Junction Transistors (BJT) BDX33BG attributes and parameters. Explore more Power Bipolar Junction Transistors (BJT) devices from Onsemi

Specs

Additional Features:

LEADFORM OPTIONS ARE AVAILABLE

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

80 V

Minimum DC Current Gain (hFE):

750

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

NPN

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Nominal Transition Frequency (fT):

Trade Compliance

BDX33BG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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