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AX-SFJK-1-01-TX30

Onsemi

AX-SFJK-1-01-TX30 by Onsemi

AX-SFJK-1-01-TX30 by Onsemi is a Network Interface chip with 40 terminals in a rectangular shape. It operates b/w -40 to 85 °C and has a peak reflow temperature of 260 °C. Ideal for industrial telecom applications, it features a terminal pitch of 0.5mm and data rate of 0.0006 Mbps.

Median Price

$4.062

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2,813 parts In-Stock

1+ parts

$1.159

100+ parts

$1.088

1k+ parts

$1.035

10k+ parts

-

2,813

$1.159

$1.088

$1.035

-

Chip1Stop

Japan . 2,813 parts In-Stock

1+ parts

$1.520

100+ parts

$1.088

1k+ parts

$1.040

10k+ parts

-

2,813

$1.520

$1.088

$1.040

-

Rochester

USA . 84,241 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

84,241

-

$3.610

$3.230

$3.040

DigiKey

USA . 84,241 parts In-Stock

1+ parts

-

100+ parts

$4.750

1k+ parts

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84,241

-

$4.750

-

-

Verical

USA . 77,925 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

$3.800

77,925

-

$4.513

$4.037

$3.800

Farnell

UK . 77,925 parts In-Stock

1+ parts

-

100+ parts

-

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-

10k+ parts

$9.970

77,925

-

-

-

$9.970

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 632 parts In-Stock

1+ parts

$1.101

100+ parts

-

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632

$1.101

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-

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Vyrian

USA . 267 parts In-Stock

1+ parts

$1.159

100+ parts

-

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267

$1.159

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-

-

Chip Stock

USA . 52,000 parts In-Stock

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52,000

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,284 parts In-Stock

1+ parts

$1.043

100+ parts

-

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2,284

$1.043

-

-

-

Corohmni

South Africa . 367 parts In-Stock

1+ parts

$1.159

100+ parts

-

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10k+ parts

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367

$1.159

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-

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Continental Prestige Electronics

USA . 77,925 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$9.970

10k+ parts

-

77,925

-

-

$9.970

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SupplyDigital Components

Austria . 5,128 parts In-Stock

1+ parts

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100+ parts

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5,128

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

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5,000

-

-

-

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TANS Electronics

Latvia . 4,918 parts In-Stock

1+ parts

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4,918

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-

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Kulean Microsystems

USA . 4,410 parts In-Stock

1+ parts

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4,410

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Problanco Electronics

Mexico . 3,225 parts In-Stock

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3,225

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-

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Native Components

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.702

10k+ parts

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1,000

-

-

$3.702

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Northwest PG Solutions

USA . 411 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.740

10k+ parts

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411

-

-

$3.740

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UHIMA Technologies

Türkiye . 407 parts In-Stock

1+ parts

-

100+ parts

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10k+ parts

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407

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Overview

Elevate your network interfaces with the AX-SFJK-1-01-TX30 by Onsemi. Manufactured with precision and expertise, this product offers unmatched quality and reliability. Ideal for a wide range of applications, this chip carrier with heat sink/slug design provides seamless integration and optimal performance. With its innovative features and cutting-edge technology, customers can expect superior connectivity and efficiency. Upgrade your network interfaces today and experience the difference with Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for various applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this product can withstand challenging environmental conditions.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V ensures compatibility with a wide range of systems and devices.

Data Rate: 0.0006 Mbps

Although the data rate may seem low, this product is designed for specific applications where low-speed transmission is sufficient.

Technical Specifications

Network Interfaces AX-SFJK-1-01-TX30 attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC28,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AX-SFJK-1-01-TX30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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