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AX-SFJK-API-1-01-XXXX

Onsemi

AX-SFJK-API-1-01-XXXX by Onsemi

AX-SFJK-API-1-01-XXXX by Onsemi is a Network Interface chip with 40 terminals, operating at -40 to 85 °C. It features a 0.5 mm terminal pitch, 0.0006 Mbps data rate, and is ideal for telecom interface circuits in industrial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

< 1k

Distributors (In-Stock)

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Vyrian

USA . 498 parts In-Stock

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498

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Digiode

USA . 110 parts In-Stock

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110

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Distributors (Availability)

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Native Components

USA . 541 parts In-Stock

1+ parts

$0.181

100+ parts

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1k+ parts

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$0.174

541

$0.181

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$0.174

Northwest PG Solutions

USA . 862 parts In-Stock

1+ parts

$0.199

100+ parts

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1k+ parts

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$0.175

862

$0.199

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$0.175

SupplyDigital Components

Austria . 7,663 parts In-Stock

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7,663

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Problanco Electronics

Mexico . 6,441 parts In-Stock

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6,441

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TANS Electronics

Latvia . 4,810 parts In-Stock

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4,810

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Corphita

USA . 2,373 parts In-Stock

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2,373

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Kulean Microsystems

USA . 1,811 parts In-Stock

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1,811

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Corohmni

South Africa . 495 parts In-Stock

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495

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UHIMA Technologies

Türkiye . 157 parts In-Stock

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157

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Overview

Discover the cutting-edge AX-SFJK-API-1-01-XXXX by Onsemi, a high-quality network interface designed to revolutionize your connectivity experience. Manufactured by industry leader Onsemi, this product boasts unrivaled reliability and performance, making it a top choice for a wide range of applications. From telecom to industrial settings, this chip carrier with a very thin profile offers seamless integration and exceptional value. Stay ahead of the curve with the AX-SFJK-API-1-01-XXXX and elevate your networking capabilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the product suitable for a wide range of applications.

Surface Mount: YES

The ability for surface mounting makes installation easy and efficient, saving time and effort.

Package Shape: SQUARE

The square shape allows for easy integration into circuit designs and ensures space efficiency.

No. of Terminals: 40

Having a higher number of terminals allows for more connections and versatility in use.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style provides efficient heat dissipation and a compact form factor for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, the product can withstand a wide range of environmental conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Position: QUAD

The quad terminal position allows for easy soldering and secure connections.

Maximum Seated Height: 1 mm

The low seated height minimizes space requirements and allows for compact designs.

Width: 5 mm

The narrow width makes the product suitable for applications where space is limited.

Length: 7 mm

The compact length ensures the product can fit into small spaces while providing the necessary functionality.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable performance in harsh industrial environments.

Terminal Form: NO LEAD

The no-lead terminal form is environmentally friendly and provides a reliable connection.

Telecom IC Type: INTERFACE CIRCUIT

The interface circuit type is ideal for telecom applications, ensuring seamless communication and data transfer.

Nominal Supply Voltage: 3.3 V

The 3.3 V supply voltage is commonly used in electronics, making the product compatible with many systems.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density connections, making the product suitable for advanced electronic designs.

Data Rate: 0.0006 Mbps

The low data rate is sufficient for basic data transmission, making the product suitable for simple networking applications.

Technical Specifications

Network Interfaces AX-SFJK-API-1-01-XXXX attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

AX-SFJK-API-1-01-XXXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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