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AX-SFEU-1-01-TX30

Onsemi

AX-SFEU-1-01-TX30 by Onsemi

AX-SFEU-1-01-TX30 by Onsemi is a Network Interface chip carrier with 40 terminals, operating temperature range of -40 to 85°C. It features nickel gold palladium terminal finish, 0.5mm pitch, and data rate of 0.0006 Mbps. Ideal for telecom circuits, this IC has a nominal voltage of 3V and is suitable for industrial applications.

Median Price

$11.200

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 3,247 parts In-Stock

1+ parts

$18.590

100+ parts

$14.221

1k+ parts

$13.057

10k+ parts

-

3,247

$18.590

$14.221

$13.057

-

Farnell

UK . 2,032 parts In-Stock

1+ parts

$21.919

100+ parts

$16.175

1k+ parts

$14.277

10k+ parts

-

2,032

$21.919

$16.175

$14.277

-

Rochester

USA . 2,032 parts In-Stock

1+ parts

-

100+ parts

$3.610

1k+ parts

$3.230

10k+ parts

$3.040

2,032

-

$3.610

$3.230

$3.040

Verical

USA . 2,032 parts In-Stock

1+ parts

-

100+ parts

$4.513

1k+ parts

$4.037

10k+ parts

-

2,032

-

$4.513

$4.037

-

Mouser Electronics

USA . 434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$11.200

434

-

-

-

$11.200

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 259 parts In-Stock

1+ parts

$12.008

100+ parts

-

1k+ parts

-

10k+ parts

-

259

$12.008

-

-

-

Nova Conductors

Japan . 1,000 parts In-Stock

1+ parts

$12.354

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

$12.354

-

-

-

Chip Stock

USA . 77,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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77,000

-

-

-

-

Vyrian

USA . 3,169 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,169

-

-

-

-

VNN

France . 2,720 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,720

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 1,616 parts In-Stock

1+ parts

$9.520

100+ parts

-

1k+ parts

-

10k+ parts

-

1,616

$9.520

-

-

-

Corohmni

South Africa . 228 parts In-Stock

1+ parts

$11.200

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$11.200

-

-

-

Corphita

USA . 2,207 parts In-Stock

1+ parts

$11.376

100+ parts

-

1k+ parts

-

10k+ parts

-

2,207

$11.376

-

-

-

Continental Prestige Electronics

USA . 2,290 parts In-Stock

1+ parts

$16.980

100+ parts

$12.530

1k+ parts

-

10k+ parts

-

2,290

$16.980

$12.530

-

-

Problanco Electronics

Mexico . 7,778 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,778

-

-

-

-

SupplyDigital Components

Austria . 4,662 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,662

-

-

-

-

Argo Parts USA

USA . 3,997 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,997

-

-

-

-

TANS Electronics

Latvia . 2,279 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,279

-

-

-

-

Kulean Microsystems

USA . 1,979 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,979

-

-

-

-

UHIMA Technologies

Türkiye . 589 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

589

-

-

-

-

Netroflash

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$12.107

1k+ parts

$11.736

10k+ parts

$11.489

50

-

$12.107

$11.736

$11.489

Overview

Unlock seamless connectivity and unparalleled performance with the AX-SFEU-1-01-TX30 by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-of-the-line network interfaces that guarantee reliability and efficiency. Ideal for a wide range of applications, this product offers customers the value of hassle-free installation, high-speed data transfer, and compatibility with various devices. Elevate your networking experience with the AX-SFEU-1-01-TX30 and enjoy a seamless connection like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and resistance to environmental factors, making the network interface reliable for long-term use.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on circuit boards, saving space and reducing manufacturing costs.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature, this network interface can perform reliably in various environmental conditions without overheating.

Nominal Supply Voltage: 3 V

The low supply voltage requirement makes this network interface energy-efficient and suitable for use in various power supply setups.

Data Rate: 0.0006 Mbps

Although the data rate may seem low, it can be sufficient for certain applications where high-speed data transfer is not critical, making this product cost-effective for those specific use cases.

Technical Specifications

Network Interfaces AX-SFEU-1-01-TX30 attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

40

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5 mm

Trade Compliance

AX-SFEU-1-01-TX30 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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