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AX-SFJK-1-01-XXXX

Onsemi

AX-SFJK-1-01-XXXX by Onsemi

AX-SFJK-1-01-XXXX by Onsemi is a Network Interface chip with 40 terminals, operating temperature range of -40 to 85 °C. It features a square package shape, 0.5 mm terminal pitch, and 3.3 V nominal voltage. Ideal for industrial telecom applications requiring interface circuits with data rate of 0.0006 Mbps.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,601 parts In-Stock

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1,601

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Digiode

USA . 282 parts In-Stock

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282

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SupplyDigital Components

Austria . 6,871 parts In-Stock

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TANS Electronics

Latvia . 5,667 parts In-Stock

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Kulean Microsystems

USA . 3,944 parts In-Stock

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Problanco Electronics

Mexico . 2,549 parts In-Stock

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Corphita

USA . 2,190 parts In-Stock

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UHIMA Technologies

Türkiye . 279 parts In-Stock

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Native Components

USA . 187 parts In-Stock

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$4.033

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Corohmni

South Africa . 61 parts In-Stock

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Northwest PG Solutions

USA . 1 parts In-Stock

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$4.075

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Overview

Discover the cutting-edge AX-SFJK-1-01-XXXX by Onsemi, a top-quality network interface solution that offers unparalleled performance and reliability. Manufactured by the reputable Onsemi, this product is designed to meet the demands of various applications in the telecom industry. With its advanced features and industrial-grade temperature grade, customers can rely on this product for seamless data transmission at a nominal supply voltage of 3.3V. Experience the value and benefits that this product brings to your network interfaces, making it an excellent choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for long term use in various settings.

Surface Mount: YES

The surface mount feature enables easy installation and allows for a compact design, saving valuable space on the circuit board.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliable performance even in demanding industrial environments where temperatures can fluctuate.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3V is common in many electronic devices, making this product compatible with a wide range of applications.

Data Rate: 0.0006 Mbps

While the data rate may seem low, for certain applications where speed is not critical, this product can offer a cost-effective solution.

Technical Specifications

Network Interfaces AX-SFJK-1-01-XXXX attributes and parameters. Explore more Network Interfaces devices from Onsemi

Specs

Data Rate:

.0006 Mbps

JESD-30 Code:

R-PQCC-N40

Length:

7 mm

No. of Functions:

1

No. of Terminals:

40

No. of Transceivers:

1

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC40,.2X.27,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

5 mm

Trade Compliance

AX-SFJK-1-01-XXXX Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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