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AMIS30621C6217G

Onsemi

AMIS30621C6217G by Onsemi

AMIS30621C6217G by Onsemi is a Motion Control IC with 20 terminals, operating voltage range of 6.5-29V, and peak reflow temperature of 260 °C. Ideal for stepper motor control applications due to its small outline package and gull wing terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 12,398 parts In-Stock

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Digiode

USA . 1,328 parts In-Stock

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1,328

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Distributors (Availability)

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Microchip USA

USA . 1,849 parts In-Stock

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$19.500

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$19.500

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AZTECH Wire

Italy . 51 parts In-Stock

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$21.900

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51

$21.900

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Native Components

USA . 832 parts In-Stock

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$133.448

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$128.110

832

$133.448

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$128.110

Northwest PG Solutions

USA . 391 parts In-Stock

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$146.793

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391

$146.793

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TANS Electronics

Latvia . 8,002 parts In-Stock

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Problanco Electronics

Mexico . 4,906 parts In-Stock

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SupplyDigital Components

Austria . 4,389 parts In-Stock

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Kulean Microsystems

USA . 3,998 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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645

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Robosynatics

Brazil . 350 parts In-Stock

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350

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Lucentia Tech

USA . 350 parts In-Stock

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$10.273

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$9.513

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$9.513

350

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$9.513

$9.513

Corphita

USA . 324 parts In-Stock

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Corohmni

South Africa . 78 parts In-Stock

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Overview

Discover the cutting-edge AMIS30621C6217G by Onsemi, a top-quality Motion Control IC that brings precision and efficiency to your applications. With a focus on innovation and reliability, Onsemi delivers exceptional products that meet the highest industry standards. This stepper motor controller offers unparalleled value and benefits, making it the ideal choice for a wide range of motion control applications. Upgrade your projects with the AMIS30621C6217G and experience advanced performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material is durable and provides good protection for the IC, increasing its longevity.

Surface Mount: YES

Surface mount installation makes it easy to integrate this IC into various electronic devices, saving space and reducing assembly time.

Nominal Supply Voltage (Vsup): 8 V

Operating at a nominal supply voltage of 8V allows for consistent and efficient performance of the IC.

No. of Terminals: 20

Having 20 terminals provides flexibility in connectivity options and allows for more functionality in the IC.

Terminal Finish: TIN

Tin terminal finish ensures good electrical conductivity and corrosion resistance, improving the overall reliability of the IC.

Width (mm): 7.5 mm

With a compact width of 7.5mm, this IC can be easily integrated into small spaces or densely packed circuit boards.

Minimum Supply Voltage (Vsup): 6.5 V

Having a low minimum supply voltage of 6.5V ensures that the IC can operate even in low power scenarios, improving its versatility.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering during assembly, ensuring a reliable connection.

Moisture Sensitivity Level (MSL): 2

With a moisture sensitivity level of 2, this IC is less prone to moisture-related damage during manufacturing and storage.

Maximum Supply Voltage (Vsup): 29 V

The high maximum supply voltage of 29V increases the range of potential applications for this IC, making it versatile in different settings.

Technical Specifications

Motion Control ICs AMIS30621C6217G attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

12.77 mm

Moisture Sensitivity Level (MSL):

2

No. of Functions:

1

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

6.5/29

Qualification:

Not Qualified

Maximum Seated Height:

2.64 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10 mA

Maximum Supply Voltage (Vsup):

29 V

Minimum Supply Voltage (Vsup):

6.5 V

Nominal Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

AMIS30621C6217G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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