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74HCU04DR2G

Onsemi

74HCU04DR2G by Onsemi

74HCU04DR2G by Onsemi is a CMOS Logic Gates IC with 6 functions, 21 ns propagation delay at 3V. It operates in a temperature range of -55 to 125 °C and has a max supply voltage of 6V. Ideal for military-grade applications requiring fast signal processing in compact spaces.

Median Price

$0.114

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 673,316 parts In-Stock

1+ parts

-

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$0.119

1k+ parts

$0.099

10k+ parts

$0.088

673,316

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$0.119

$0.099

$0.088

Verical

USA . 402,300 parts In-Stock

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$0.110

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$0.110

Distributors (In-Stock)

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Digiode

USA . 636 parts In-Stock

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$0.093

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636

$0.093

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Vyrian

USA . 3,475 parts In-Stock

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3,475

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Semtec, LLC

USA . 12 parts In-Stock

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Corphita

USA . 1,511 parts In-Stock

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$0.088

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$0.088

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Corohmni

South Africa . 261 parts In-Stock

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$0.098

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261

$0.098

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Native Components

USA . 136 parts In-Stock

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$1.190

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$1.190

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Northwest PG Solutions

USA . 293 parts In-Stock

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$1.309

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293

$1.309

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AZTECH Wire

Italy . 224 parts In-Stock

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$18.090

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$18.090

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Continental Prestige Electronics

USA . 673,316 parts In-Stock

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$0.085

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673,316

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$0.085

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SupplyDigital Components

Austria . 6,241 parts In-Stock

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Microchip USA

USA . 5,461 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,626 parts In-Stock

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Kulean Microsystems

USA . 3,364 parts In-Stock

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Perfect Parts

USA . 3,027 parts In-Stock

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TANS Electronics

Latvia . 1,131 parts In-Stock

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Problanco Electronics

Mexico . 1,005 parts In-Stock

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UHIMA Technologies

Türkiye . 546 parts In-Stock

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Kepictronics

USA . 430 parts In-Stock

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Overview

Experience top-notch quality and reliability with the 74HCU04DR2G by Onsemi, a leading manufacturer in the industry. This logic gates product offers exceptional performance and versatility, making it ideal for a wide range of applications. With a focus on value and innovation, customers can trust in the benefits and advantages that this product brings to their projects. Trust Onsemi for all your logic gate needs and experience the difference in quality and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material that can withstand normal handling and environmental conditions.

Propagation Delay At Nominal Supply: 21 ns

Fast response time ensures quick processing of signals.

Surface Mount: YES

Easy to mount on circuit boards, saving space and simplifying assembly.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common supply voltages, making it versatile for different applications.

No. of Functions: 6

Provides multiple logic functions in a single component, reducing the need for multiple separate gates.

Maximum Operating Temperature: 125 °C

Suitable for use in a wide range of operating conditions without overheating.

Technology: CMOS

Low power consumption and high noise immunity, making it efficient and reliable.

Technical Specifications

Logic Gates 74HCU04DR2G attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

HC/UH

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

6

No. of Inputs:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

21 ns

Propagation Delay (tpd):

105 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74HCU04DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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