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74FST3126DT

Onsemi

74FST3126DT by Onsemi

The Onsemi 74FST3126DT is a CMOS bus driver with 4 functions, operating at temperatures from -40 to 85 °C. It has a propagation delay of 0.25 ns and supports a supply voltage range of 4-5.5 V. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.225

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 6,984 parts In-Stock

1+ parts

-

100+ parts

$0.225

1k+ parts

$0.186

10k+ parts

$0.166

6,984

-

$0.225

$0.186

$0.166

DigiKey

USA . 6,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.280

6,984

-

-

-

$0.280

Verical

USA . 5,832 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.208

5,832

-

-

-

$0.208

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,945 parts In-Stock

1+ parts

$0.175

100+ parts

-

1k+ parts

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10k+ parts

-

1,945

$0.175

-

-

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Vyrian

USA . 1,532 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

-

10k+ parts

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1,532

$0.184

-

-

-

DigiKey Marketplace

USA . 6,984 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.190

10k+ parts

-

6,984

-

-

$0.190

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 79 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

79

$0.166

-

-

-

Corohmni

South Africa . 71 parts In-Stock

1+ parts

$0.184

100+ parts

-

1k+ parts

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10k+ parts

-

71

$0.184

-

-

-

Component Stockers USA

USA . 17,153 parts In-Stock

1+ parts

$0.190

100+ parts

$0.180

1k+ parts

$0.160

10k+ parts

-

17,153

$0.190

$0.180

$0.160

-

Native Components

USA . 212 parts In-Stock

1+ parts

$14.930

100+ parts

-

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10k+ parts

-

212

$14.930

-

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Northwest PG Solutions

USA . 2,071 parts In-Stock

1+ parts

$16.423

100+ parts

$14.781

1k+ parts

-

10k+ parts

-

2,071

$16.423

$14.781

-

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QUARKTWIN TECHNOLOGY LTD

USA . 26,466 parts In-Stock

1+ parts

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100+ parts

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26,466

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SupplyDigital Components

Austria . 7,963 parts In-Stock

1+ parts

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7,963

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Continental Prestige Electronics

USA . 6,984 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.155

10k+ parts

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6,984

-

-

$0.155

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Kulean Microsystems

USA . 6,182 parts In-Stock

1+ parts

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6,182

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Problanco Electronics

Mexico . 3,271 parts In-Stock

1+ parts

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3,271

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TANS Electronics

Latvia . 2,101 parts In-Stock

1+ parts

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2,101

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UHIMA Technologies

Türkiye . 595 parts In-Stock

1+ parts

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595

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Kepictronics

USA . 88 parts In-Stock

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88

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Overview

Elevate your electronic designs with the 74FST3126DT by Onsemi, a high-quality bus driver and transceiver that offers unparalleled performance and reliability. Manufactured by Onsemi, a trusted name in the industry, this versatile component is perfect for a wide range of applications. With its compact design and advanced technology, the 74FST3126DT delivers exceptional value and benefits to customers, ensuring seamless operation and superior results. Upgrade your projects today with the 74FST3126DT and experience the difference that quality and innovation can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body makes the product lightweight and durable, ensuring long-term reliability and ease of handling.

Surface Mount: YES

The surface mount capability allows for easy and convenient installation on PCBs, saving space and simplifying the assembly process.

No. of Functions: 4

With 4 functions in one device, this product is cost-effective and efficient, reducing the need for multiple components.

Package Shape: RECTANGULAR

The rectangular package shape provides a standard form factor for compatibility with various PCB designs and layouts.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V ensures compatibility with a wide range of power sources, making this product versatile and adaptable.

Power Supplies (V): 5

The 5V power supply ensures stable and reliable operation, meeting industry-standard power requirements.

No. of Terminals: 14

With 14 terminals, this product offers ample connectivity options for interfacing with other components and peripherals.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline, thin profile, and shrink pitch package style optimizes space usage on the PCB, making it ideal for compact designs.

Propagation Delay (tpd): 0.25 ns

The low propagation delay of 0.25ns ensures fast and efficient signal transmission, reducing latency and improving system performance.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures reliability in harsh environmental conditions, enhancing the product's durability.

Output Characteristics: 3-STATE

The 3-STATE output characteristics offer flexibility in controlling the output signal, allowing for tristate logic implementation in the system.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C enables operation in cold environments without compromising performance or reliability.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures stable electrical connections, enhancing the product's longevity.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting options, allowing for versatile integration into various system configurations.

No. of Ports: 2

With 2 ports, this product enables bidirectional communication between connected devices, enhancing system interoperability.

Maximum Seated Height: 1.2 mm

The low maximum seated height of 1.2mm ensures minimal space requirements on the PCB, facilitating compact and space-efficient designs.

Width: 4.4 mm

The narrow width of 4.4mm allows for efficient use of PCB real estate, enabling dense component packing and optimized layout designs.

Output Polarity: TRUE

The true output polarity simplifies signal interpretation and processing, ensuring accurate communication between devices.

Minimum Supply Voltage (Vsup): 4 V

The minimum supply voltage of 4V ensures compatibility with low-power applications, making this product suitable for a wide range of use cases.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C enables convenient and reliable soldering during assembly, ensuring secure component attachment.

Length: 5 mm

The compact length of 5mm facilitates space-saving PCB layout designs, contributing to overall system miniaturization and efficiency.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures robust performance in harsh operating environments, making this product suitable for industrial applications.

Technology: CMOS

The CMOS technology provides low power consumption and high noise immunity, resulting in efficient operation and reliable signal integrity.

Terminal Form: GULL WING

The gull wing terminal form facilitates secure solder connections and ease of handling during assembly, enhancing product reliability and manufacturability.

Terminal Pitch: 0.65 mm

The narrow terminal pitch of 0.65mm allows for high-density mounting on the PCB, enabling compact and space-efficient system designs.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage of 5.5V provides a safety margin for voltage fluctuations, ensuring reliable operation and protection against overvoltage conditions.

Technical Specifications

Bus Driver & Transceivers 74FST3126DT attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74FST3126DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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