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74FST3245DT

Onsemi

74FST3245DT by Onsemi

The Onsemi 74FST3245DT is an 8-bit bus driver with a propagation delay of 0.25 ns. It operates at a nominal voltage of 5V and has a temperature range of -40 to 85 °C. Ideal for industrial applications requiring fast signal transmission in compact spaces.

Median Price

$0.127

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 34,575 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

34,575

-

$0.132

$0.110

$0.098

DigiKey

USA . 34,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.170

34,575

-

-

-

$0.170

Farnell

UK . 34,575 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.087

34,575

-

-

-

$0.087

Verical

USA . 24,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.122

24,600

-

-

-

$0.122

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,072 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

-

2,072

$0.087

-

-

-

Digiode

USA . 1,496 parts In-Stock

1+ parts

$0.103

100+ parts

-

1k+ parts

-

10k+ parts

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1,496

$0.103

-

-

-

New Tech Sourcing

USA . 86 parts In-Stock

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86

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 434 parts In-Stock

1+ parts

$0.087

100+ parts

-

1k+ parts

-

10k+ parts

-

434

$0.087

-

-

-

Corphita

USA . 2,187 parts In-Stock

1+ parts

$0.097

100+ parts

-

1k+ parts

-

10k+ parts

-

2,187

$0.097

-

-

-

Continental Prestige Electronics

USA . 34,575 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.091

10k+ parts

-

34,575

-

-

$0.091

-

SupplyDigital Components

Austria . 8,114 parts In-Stock

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8,114

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TANS Electronics

Latvia . 7,834 parts In-Stock

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7,834

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Kulean Microsystems

USA . 6,288 parts In-Stock

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6,288

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Problanco Electronics

Mexico . 5,056 parts In-Stock

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5,056

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Northwest PG Solutions

USA . 2,146 parts In-Stock

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2,146

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Native Components

USA . 815 parts In-Stock

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815

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UHIMA Technologies

Türkiye . 783 parts In-Stock

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783

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Overview

Enhance your electronic designs with the high-quality 74FST3245DT bus driver & transceiver from Onsemi. This versatile component offers seamless communication between multiple devices, making it ideal for a wide range of applications. With a compact design and reliable performance, this product provides exceptional value to customers looking for efficient and cost-effective solutions. Trust Onsemi's expertise in semiconductor manufacturing to deliver superior products that meet your needs. Upgrade your projects with the 74FST3245DT and experience the benefits of cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for use in various environments.

Surface Mount: YES

Being surface mountable makes the product easy to integrate into circuit boards, saving space and simplifying assembly.

Propgation Delay: 0.25 ns

With a very low propagation delay, this product ensures quick and efficient signal transmission, essential for bus drivers and transceivers.

Width: 4.4 mm

The compact width of 4.4mm enables the product to be used in tight spaces or densely populated PCB layouts.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product energy efficient and reliable in data transmission.

Technical Specifications

Bus Driver & Transceivers 74FST3245DT attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74FST3245DT Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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