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74FST3257DR2G

Onsemi

74FST3257DR2G by Onsemi

74FST3257DR2G by Onsemi is a bus driver & transceiver with 4 functions, 0.25 ns propagation delay, and 50 pF load capacitance. It operates at a supply voltage of 4.5V and has a temperature range of -40 to 85°C. Ideal for bidirectional control applications in industrial settings due to its compact size and low power consumption.

Median Price

$0.376

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Arrow

USA . 34 parts In-Stock

1+ parts

$0.618

100+ parts

$0.331

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-

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$0.242

34

$0.618

$0.331

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$0.242

DigiKey

USA . 172 parts In-Stock

1+ parts

$1.220

100+ parts

$0.473

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$0.265

172

$1.220

$0.473

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$0.265

Rochester

USA . 92,186 parts In-Stock

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-

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$0.341

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$0.283

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$0.253

92,186

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$0.341

$0.283

$0.253

Verical

USA . 55,169 parts In-Stock

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$0.384

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$0.316

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$0.384

$0.316

Mouser Electronics

USA . 2,494 parts In-Stock

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$0.254

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Chip1Stop

Japan . 947 parts In-Stock

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$0.369

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947

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$0.369

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Distributors (In-Stock)

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Nova Conductors

Japan . 30 parts In-Stock

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$0.262

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$0.262

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Digiode

USA . 845 parts In-Stock

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$0.266

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Vyrian

USA . 27,299 parts In-Stock

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Flip Electronics

USA . 22,500 parts In-Stock

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Bristol Electronics

USA . 7,880 parts In-Stock

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$0.491

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$0.212

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$0.197

7,880

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$0.491

$0.212

$0.197

Cyclops Electronics Ltd

UK . 7,500 parts In-Stock

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VNN

France . 6,499 parts In-Stock

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Dan-Mar Components

USA . 6,433 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Chip Stock

USA . 4,000 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 27,655 parts In-Stock

1+ parts

$0.216

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27,655

$0.216

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Corphita

USA . 1,721 parts In-Stock

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$0.252

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$0.252

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Netroflash

USA . 2,000 parts In-Stock

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$0.262

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$0.249

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$0.244

2,000

$0.262

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$0.249

$0.244

Argo Parts USA

USA . 1,844 parts In-Stock

1+ parts

$0.262

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$0.254

1,844

$0.262

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$0.254

Semicontronic

India . 27,161 parts In-Stock

1+ parts

$0.470

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$0.458

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$0.456

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27,161

$0.470

$0.458

$0.456

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Aztec Data Supply Inc.

USA . 268 parts In-Stock

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$12.650

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Corohmni

South Africa . 5 parts In-Stock

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$22.923

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Continental Prestige Electronics

USA . 86,688 parts In-Stock

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$0.350

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Perfect Parts

USA . 29,139 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 19,388 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

USA . 13,830 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,015 parts In-Stock

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Kepictronics

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Metaverse IC Inc.

Canada . 5,000 parts In-Stock

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Assy Fe

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SupplyDigital Components

Austria . 4,965 parts In-Stock

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TANS Electronics

Latvia . 4,452 parts In-Stock

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Problanco Electronics

Mexico . 991 parts In-Stock

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Kulean Microsystems

USA . 270 parts In-Stock

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UHIMA Technologies

Türkiye . 207 parts In-Stock

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GreenTree Electronics

Israel . 197 parts In-Stock

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Overview

Enhance your electronic designs with the reliable 74FST3257DR2G bus driver & transceiver by Onsemi. Known for their high-quality products, Onsemi delivers exceptional performance and durability. This versatile component is ideal for a wide range of applications, offering seamless communication between multiple devices. With fast propagation delay and 3-STATE output characteristics, this small outline package ensures efficient operation at an industrial temperature grade. Upgrade your projects with the value and benefits that Onsemi's 74FST3257DR2G brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight material ensures the product is long-lasting and easy to handle.

Propagation Delay At Nominal Supply: 0.25 ns

Fast propagation delay ensures quick and efficient signal transmission.

Surface Mount: YES

Easily mountable on circuit boards, saving space and making installation convenient.

No. of Functions: 4

Multiple functions packed into one component, reducing the need for additional components.

Nominal Supply Voltage / Vsup (V): 4.5

Optimal supply voltage for efficient performance.

Load Capacitance (CL): 50 pF

Suitable capacitance for smooth operation and signal transmission.

Output Characteristics: 3-STATE

3-state output allows for high impedance when disabled, enhancing flexibility in circuit design.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the product efficient and reliable.

Technical Specifications

Bus Driver & Transceivers 74FST3257DR2G attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

ENABLE LOW

Count Direction:

BIDIRECTIONAL

Family:

CBT/FST/QS/5C/B

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

4

No. of Ports:

3

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

100 mA

Propagation Delay At Nominal Supply:

.25 ns

Propagation Delay (tpd):

.25 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Other Logic ICs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

74FST3257DR2G Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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