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2SK3816-DL-E

Onsemi

2SK3816-DL-E by Onsemi

The Onsemi 2SK3816-DL-E is a N-CHANNEL Power FET with 40A max drain current and 50W max power dissipation. Ideal for applications requiring high power handling in enhancement mode operation, such as power supplies and motor control systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,772 parts In-Stock

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Digiode

USA . 1,161 parts In-Stock

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AZTECH Wire

Italy . 90 parts In-Stock

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$20.680

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90

$20.680

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Native Components

USA . 81 parts In-Stock

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$200.963

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$192.925

81

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$192.925

Northwest PG Solutions

USA . 1,423 parts In-Stock

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$221.059

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Kulean Microsystems

USA . 5,775 parts In-Stock

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SupplyDigital Components

Austria . 4,871 parts In-Stock

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TANS Electronics

Latvia . 1,385 parts In-Stock

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Problanco Electronics

Mexico . 948 parts In-Stock

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Corphita

USA . 583 parts In-Stock

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UHIMA Technologies

Türkiye . 553 parts In-Stock

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Corohmni

South Africa . 499 parts In-Stock

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Overview

Power up your projects with the 2SK3816-DL-E from Onsemi! With a reputation for top-quality manufacturing, Onsemi's Power Field Effect Transistors (FET) are known for their reliability and performance. This N-CHANNEL FET offers maximum drain current of 40A and maximum power dissipation of 50W, making it ideal for a wide range of applications. Whether you're designing automotive electronics or industrial machinery, this Enhancement Mode FET delivers the power and efficiency you need. Trust Onsemi for cutting-edge technology and superior products that exceed your expectations.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs typically have lower ON resistance and higher current handling capabilities compared to P-CHANNEL FETs, making them suitable for high-power applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and makes the overall system more compact and efficient.

Surface Mount: YES

Surface mount packaging allows for easy and automated assembly, making it ideal for mass production and reducing manufacturing costs.

Operating Mode: ENHANCEMENT MODE

ENHANCEMENT MODE FETs can be easily controlled with a positive voltage, offering better efficiency and faster response in switching applications.

Maximum Drain Current (Abs) (ID): 40 A

High maximum drain current capacity allows the FET to handle large loads without overheating, ensuring reliable operation in high-power scenarios.

Maximum Power Dissipation (Abs): 50 W

High power dissipation capability enables the FET to handle high power densities and prevents thermal runaway under heavy loads.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

METAL-OXIDE SEMICONDUCTOR technology offers low gate drive requirements, minimal leakage current, and high switching speeds for efficient performance.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this FET can withstand higher temperature environments, making it suitable for industrial applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth terminal finish provides good solderability and reliability, ensuring secure connections and long-lasting performance in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) 2SK3816-DL-E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

40 A

Maximum Drain Current (ID):

40 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Trade Compliance

2SK3816-DL-E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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