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XC56309AG100A

NXP Semiconductors

XC56309AG100A by NXP Semiconductors

NXP Semiconductors XC56309AG100A is a 144-terminal DSP with 3.3V nominal voltage, 100MHz clock frequency, and -40 to 100°C operating temperature range. Ideal for industrial applications requiring high-speed data processing in a compact square package with low power mode and barrel shifter capabilities.

Median Price

$1.000

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,220 parts In-Stock

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$1.000

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Digiode

USA . 4,210 parts In-Stock

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Anansix

USA . 150 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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100

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PC Components Company LLC

USA . 9 parts In-Stock

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Bristol Electronics

USA . 2 parts In-Stock

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One Stop Electronics

USA . 3,065 parts In-Stock

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$3.000

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Ampacity Inc.

Singapore . 1,464 parts In-Stock

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$10.000

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Corohmni

South Africa . 740 parts In-Stock

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$43.834

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Component Stockers USA

USA . 354 parts In-Stock

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$99.990

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Microchip USA

USA . 344 parts In-Stock

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$214.699

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Argo Parts USA

USA . 5,833 parts In-Stock

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Continental Prestige Electronics

USA . 4,129 parts In-Stock

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Corphita

USA . 3,469 parts In-Stock

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Perfect Parts

USA . 1,120 parts In-Stock

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Aranea Global

USA . 500 parts In-Stock

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UNI Independent Distributors

Spain . 53 parts In-Stock

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Futuretech Components

Singapore . 32 parts In-Stock

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Overview

Experience unparalleled performance with the XC56309AG100A by NXP Semiconductors, a cutting-edge Digital Signal Processor designed for a wide range of applications. Manufactured with precision and expertise, this DSP offers superior quality and reliability. From audio processing to telecommunications, this versatile product delivers unmatched value, efficiency, and benefits to customers looking for top-tier performance in their electronic devices. Upgrade your technology with the XC56309AG100A and unlock endless possibilities in signal processing.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and cost-effectiveness for the package.

Surface Mount: YES

Surface mount technology allows for easy installation and compact design.

Maximum Supply Voltage: 3.6 V

Higher maximum supply voltage allows for flexibility in power requirements.

Address Bus Width: 18

Wide address bus width enables efficient memory addressing capabilities.

No. of Terminals: 144

Higher number of terminals allows for more connectivity options and functionality.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliable performance in various environments.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast processing speed for real-time applications.

Peripheral IC Type: DIGITAL SIGNAL PROCESSOR, OTHER

Specialized peripheral IC type indicates optimized performance for digital signal processing tasks.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Technical Specifications

Digital Signal Processors (DSPs) XC56309AG100A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO HAVING 16-BIT ALU

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC56309AG100A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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