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XC56309VF100A

NXP Semiconductors

XC56309VF100A by NXP Semiconductors

DIGITAL SIGNAL PROCESSOR, OTHER; Temperature Grade: INDUSTRIAL; Terminal Form: BALL; No. of Terminals: 196; Package Code: LBGA; Package Shape: SQUARE;

Median Price

$36.050

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Avnet

USA . 53 parts In-Stock

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Rochester

USA . 6 parts In-Stock

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$36.050

1k+ parts

$32.260

10k+ parts

$30.360

6

-

$36.050

$32.260

$30.360

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,858 parts In-Stock

1+ parts

$38.142

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$38.142

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Vyrian

USA . 1,576 parts In-Stock

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$40.150

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Rebound Electronics

UK . 872 parts In-Stock

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Anansix

USA . 475 parts In-Stock

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475

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Nova Conductors

Japan . 69 parts In-Stock

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Lakeland Logistics Inc

USA . 14 parts In-Stock

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Bristol Electronics

USA . 14 parts In-Stock

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LWI Electronics Inc

India . 1 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 940 parts In-Stock

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$34.130

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$34.130

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Corphita

USA . 1,408 parts In-Stock

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$36.135

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Microchip USA

USA . 465 parts In-Stock

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$37.059

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Corohmni

South Africa . 88 parts In-Stock

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$63.715

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Perfect Parts

USA . 40,248 parts In-Stock

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Authorized Procurement Solutions

USA . 35,200 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,451 parts In-Stock

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UNI Independent Distributors

Spain . 7,352 parts In-Stock

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Continental Prestige Electronics

USA . 2,444 parts In-Stock

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Aranea Global

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 996 parts In-Stock

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996

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Technical Specifications

Digital Signal Processors (DSPs) XC56309VF100A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO HAVING 16-BIT ALU

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PBGA-B196

Length:

15 mm

Low Power Mode:

YES

No. of Terminals:

196

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, LOW PROFILE

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1 mm

Terminal Position:

BOTTOM

Width:

15 mm

Peripheral IC Type:

Trade Compliance

XC56309VF100A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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