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XC56309PV100A

NXP Semiconductors

XC56309PV100A by NXP Semiconductors

NXP Semiconductors XC56309PV100A is a 144-terminal DSP with 3.3V nominal voltage, 100MHz clock frequency, and -40 to 100°C operating temperature range. Ideal for industrial applications requiring low power consumption and high-speed data processing capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Anansix

USA . 2,678 parts In-Stock

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2,678

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Digiode

USA . 1,043 parts In-Stock

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1,043

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Vyrian

USA . 381 parts In-Stock

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381

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Nova Conductors

Japan . 76 parts In-Stock

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76

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LWI Electronics Inc

India . 9 parts In-Stock

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Distributors (Availability)

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One Stop Electronics

USA . 1,725 parts In-Stock

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$22.000

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1,725

$22.000

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Ampacity Inc.

Singapore . 1,456 parts In-Stock

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$24.000

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Corohmni

South Africa . 62 parts In-Stock

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$46.415

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62

$46.415

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UNI Independent Distributors

Spain . 8,093 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,220 parts In-Stock

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2,220

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Microchip USA

USA . 1,145 parts In-Stock

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Assy Fe

Spain . 1 parts In-Stock

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Overview

Get ready to experience unparalleled performance with the XC56309PV100A by NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality Digital Signal Processors that are perfect for a wide range of applications. This innovative product offers exceptional value, benefits, and advantages to customers looking for cutting-edge technology. With advanced features like a maximum clock frequency of 100 MHz and low power mode, the XC56309PV100A provides the efficiency and reliability you need for your next project. Upgrade your electronics with NXP Semiconductors today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material ensures durability and protection for the internal components of the DSP.

Surface Mount: YES

Facilitates easy and efficient PCB assembly, saving time and production costs.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power input options for the DSP.

Address Bus Width: 18

Enhanced address bus width allows for handling of larger memory addresses, increasing processing capabilities.

Package Shape: SQUARE

Square shape makes it easier to mount and integrate into circuit designs.

No. of Terminals: 144

Higher number of terminals allow for more connections and functionalities in the DSP.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures stable performance in various environments.

Maximum Clock Frequency: 100 MHz

High clock frequency enables fast signal processing and data handling.

Internal Bus Architecture: MULTIPLE

Multiple internal bus architecture enhances data flow efficiency and overall performance of the DSP.

Low Power Mode: YES

Low power mode feature helps in reducing energy consumption and heat generation, suitable for power-sensitive applications.

Technical Specifications

Digital Signal Processors (DSPs) XC56309PV100A attributes and parameters. Explore more Digital Signal Processors (DSPs) devices from NXP Semiconductors

Specs

Additional Features:

ALSO HAVING 16-BIT ALU

Address Bus Width:

18

Barrel Shifter:

YES

Boundary Scan:

YES

Maximum Clock Frequency:

100 MHz

External Data Bus Width:

24

Format:

FIXED POINT

Internal Bus Architecture:

MULTIPLE

JESD-30 Code:

S-PQFP-G144

Length:

20 mm

Low Power Mode:

YES

No. of Terminals:

144

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

XC56309PV100A Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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