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UJA1168TK/FDJ

NXP Semiconductors

UJA1168TK/FDJ by NXP Semiconductors

UJA1168TK/FDJ by NXP Semiconductors is a CAN transceiver designed for automotive applications, featuring a 1 Mbps data rate and AEC-Q100 screening. It operates on power supplies of 3-28V and has a compact 14-terminal SO package. Ideal for reliable network interfaces in vehicles.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 11,980 parts In-Stock

1+ parts

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11,980

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Vyrian

USA . 5,930 parts In-Stock

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5,930

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Digiode

USA . 4,052 parts In-Stock

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4,052

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Anansix

USA . 1,650 parts In-Stock

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1,650

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 752 parts In-Stock

1+ parts

$11.510

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752

$11.510

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One Stop Electronics

USA . 435 parts In-Stock

1+ parts

$725.000

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435

$725.000

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Microchip USA

USA . 5,124 parts In-Stock

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5,124

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UNI Independent Distributors

Spain . 1,934 parts In-Stock

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1,934

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Corphita

USA . 1,790 parts In-Stock

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1,790

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Overview

Unlock seamless connectivity with the UJA1168TK/FDJ from NXP Semiconductors, a leader in high-quality network interfaces. Designed for reliability and efficiency, this CAN transceiver is perfect for automotive applications, ensuring robust communication under challenging conditions. With AEC-Q100 compliance, it guarantees superior performance and longevity, empowering your projects with enhanced data integrity and lower power consumption. Elevate your designs with NXP’s trusted innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology allows for a compact design and efficient use of space on PCBs, enhancing the product's integration into modern electronic devices.

Screening Level: AEC-Q100

Compliance with AEC-Q100 screening ensures high reliability and quality for automotive applications, making it a safe choice for critical systems.

Package Shape: RECTANGULAR

The rectangular package shape aids in easy placement and orientation on PCB, ensuring design flexibility and ease of assembly.

Power Supplies (V): 3/28

This wide range of power supply options allows for versatility in design and compatibility with various system voltages.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for various data and control signals, ensuring broad functionality.

Package Style (Meter): SMALL OUTLINE

The small outline package style contributes to space-saving in electronic designs, ideal for applications where board area is at a premium.

Terminal Finish: NICKEL PALLADIUM GOLD SILVER

The high-quality terminal finish offers excellent conductivity and resistance to corrosion, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal position allows for better flexibility in routing connections on PCB, enhancing design options for developers.

Maximum Time At Peak Reflow Temperature (s): 30

A maximum time of 30 seconds at peak reflow temperature helps to prevent damage to sensitive components during assembly, ensuring product integrity.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports compatibility with a range of solder types, making it versatile for different manufacturing processes.

Terminal Form: NO LEAD

No lead design reduces the environmental impact and allows for a smaller footprint, aligning with modern design and sustainability standards.

Maximum Supply Current: 67 mA

With a maximum supply current of 67 mA, the product is energy-efficient while still providing sufficient power for operation.

Telecom IC Type: CAN TRANSCEIVER

As a CAN transceiver, this product enables robust communication in automotive and industrial applications, ensuring reliable data transmission.

Terminal Pitch: 0.635 mm

The 0.635 mm terminal pitch allows for a compact design while enabling easy soldering and manufacturing processes.

Data Rate: 1 Mbps

A data rate of 1 Mbps ensures fast and efficient communication, making it suitable for modern networking applications.

Technical Specifications

Network Interfaces UJA1168TK/FDJ attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

1 Mbps

JESD-30 Code:

R-PDSO-N14

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC14,.12,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/28

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Network Interfaces

Maximum Supply Current:

67 mA

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL PALLADIUM GOLD SILVER

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

UJA1168TK/FDJ Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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