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UJA1018TK

NXP Semiconductors

UJA1018TK by NXP Semiconductors

UJA1018TK by NXP Semiconductors is a LIN transceiver with 16 terminals, AEC-Q100 screening level, and operates b/w -40 to 150°C. It comes in a small outline package suitable for automotive network interfaces. With a nominal voltage of 12V and low supply current of 4.5mA, it's ideal for automotive communication systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Flip Electronics

USA . 5,659 parts In-Stock

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Digiode

USA . 4,669 parts In-Stock

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Anansix

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Nova Conductors

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AZTECH Wire

Italy . 536 parts In-Stock

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Ampacity Inc.

Singapore . 1,162 parts In-Stock

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One Stop Electronics

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Continental Prestige Electronics

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Argo Parts USA

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Corphita

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Overview

Elevate your network interfaces with the UJA1018TK by NXP Semiconductors. Designed with top-notch quality and reliability, this LIN transceiver offers unparalleled performance for a wide range of applications. With a compact and durable package body material, this product is perfect for automotive and industrial use. Experience seamless connectivity and improved efficiency with the UJA1018TK, providing customers with outstanding value and benefits. Trust in NXP Semiconductors to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for long-term use.

Surface Mount: YES

Surface mount feature allows for easy and efficient installation on PCBs, saving time and effort during assembly.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high quality and compliance with automotive industry standards, making it a reliable choice for automotive applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this product can withstand high temperature environments, increasing its versatility.

Minimum Operating Temperature: -40 °C

The wide temperature range (-40 to 150 °C) makes this product suitable for use in various environments, ensuring performance in extreme conditions.

Maximum Supply Current: 4.5 mA

Low maximum supply current of 4.5 mA helps in reducing power consumption, making it energy-efficient.

Nominal Supply Voltage: 12 V

Operating at a nominal supply voltage of 12 V, this product is compatible with standard power sources, improving ease of integration.

Terminal Pitch: 0.65 mm

The small terminal pitch of 0.65 mm allows for high-density mounting on PCBs, optimizing space utilization in electronic devices.

Technical Specifications

Network Interfaces UJA1018TK attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N16

Length:

3.5 mm

No. of Functions:

1

No. of Terminals:

16

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC16,.13,25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

4.5 mA

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

5.5 mm

Trade Compliance

UJA1018TK Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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