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UJA1169ATK/F

NXP Semiconductors

UJA1169ATK/F by NXP Semiconductors

NXP Semiconductors' UJA1169ATK/F is a CAN FD transceiver with 15 Mbps data rate, ideal for automotive applications. It operates at 13V nominal voltage and draws a max of 67mA supply current. The small outline package measures 3.5mm in width, 5.5mm in length, and has a terminal pitch of 0.5mm.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,194 parts In-Stock

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Anansix

USA . 1,310 parts In-Stock

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1,310

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Vyrian

USA . 190 parts In-Stock

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190

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Distributors (Availability)

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AZTECH Wire

Italy . 190 parts In-Stock

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$5.986

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190

$5.986

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Semicontronic

India . 1,380 parts In-Stock

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$219.000

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$213.525

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$212.430

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$219.000

$213.525

$212.430

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One Stop Electronics

USA . 292 parts In-Stock

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$785.000

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292

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Lixinc

USA . 6,939 parts In-Stock

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6,939

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Futuretech Components

Singapore . 6,000 parts In-Stock

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GreenTree Electronics

Israel . 6,000 parts In-Stock

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Corphita

USA . 4,461 parts In-Stock

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UNI Independent Distributors

Spain . 4,314 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Argo Parts USA

USA . 922 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Continental Prestige Electronics

USA . 281 parts In-Stock

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281

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Overview

Enhance your automotive network interfaces with the UJA1169ATK/F by NXP Semiconductors. Known for their superior quality and reliability, NXP Semiconductors delivers top-notch products that exceed industry standards. The UJA1169ATK/F offers seamless integration, high performance, and advanced features suitable for a wide range of applications. Experience the value of smooth communication, increased efficiency, and enhanced functionality with this innovative CAN FD transceiver.Upgrade your automotive systems today with NXP Semiconductors!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides good durability and protection for the components inside, ensuring a longer lifespan for the product.

Surface Mount: YES

Surface mount capability makes it easier to integrate this product onto circuit boards, saving space and simplifying the assembly process.

Screening Level: AEC-Q100

AEC-Q100 screening ensures high reliability and performance, making this product suitable for automotive applications where ruggedness is required.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient use of space on the circuit board, making it ideal for compact electronic designs.

No. of Terminals: 20

Having 20 terminals provides ample connectivity options for various applications, making this product versatile and adaptable.

Package Style: SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline, heat sink/slug, and very thin profile package style promotes efficient heat dissipation and space-saving design, offering optimal performance in limited space applications.

Terminal Position: DUAL

Dual terminal position allows for higher signal integrity and better stability in connection, ensuring reliable communication in demanding environments.

Maximum Seated Height: 1 mm

Low maximum seated height enables this product to fit in slim devices or tight spaces, expanding its usability in compact electronic designs.

Width: 3.5 mm

With a width of 3.5 mm, this product is compact and space-efficient, making it suitable for applications where size constraints are a concern.

Length: 5.5 mm

The length of 5.5 mm strikes a balance between compactness and functionality, ensuring this product can deliver performance without taking up excessive space.

Terminal Form: NO LEAD

No lead terminal form minimizes the risk of lead contamination and offers environmental benefits, making this product a more sustainable choice.

Maximum Supply Current: 67 mA

With a maximum supply current of 67 mA, this product consumes low power, contributing to energy efficiency and cost savings in operation.

Telecom IC Type: CAN FD TRANSCEIVER

Being a CAN FD transceiver enables reliable and high-speed communication in telecom applications, ensuring seamless data transfer with minimal errors.

Nominal Supply Voltage: 13 V

The nominal supply voltage of 13V ensures stable and consistent power delivery to the device, supporting reliable operation in various conditions.

Terminal Pitch: 0.5 mm

Having a small terminal pitch of 0.5 mm allows for high-density mounting and better signal integrity, making this product suitable for advanced applications.

Data Rate: 15 Mbps

With a data rate of 15 Mbps, this product offers fast and efficient data transmission, meeting the requirements of high-speed communication systems.

Technical Specifications

Network Interfaces UJA1169ATK/F attributes and parameters. Explore more Network Interfaces devices from NXP Semiconductors

Specs

Data Rate:

15 Mbps

JESD-30 Code:

R-PDSO-N20

Length:

5.5 mm

No. of Functions:

1

No. of Terminals:

20

No. of Transceivers:

1

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC20,.14,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Current:

67 mA

Nominal Supply Voltage:

13 V

Surface Mount:

YES

Telecom IC Type:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

3.5 mm

Trade Compliance

UJA1169ATK/F Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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